2013
DOI: 10.1016/j.microrel.2013.04.004
|View full text |Cite
|
Sign up to set email alerts
|

Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
7
0

Year Published

2015
2015
2020
2020

Publication Types

Select...
8
1

Relationship

4
5

Authors

Journals

citations
Cited by 21 publications
(7 citation statements)
references
References 14 publications
0
7
0
Order By: Relevance
“…The pull test of the first bond was performed with a test length of 50 mm, yielding a strain rate of 5 × 10 −3 s −1 . Moreover, to better understand the differences between the Al-0.5Si and ZAS wires, current tests of the first bond (FAB) were compared [12][13][14][15][16], and a bias tensile test of the wires with different currents was performed. The schematic diagram in Figure 2 shows that, for the current test, the effective wire length was 30 mm, and the applied DC voltage increased at 0.05 V/sec from 0 V until the wire fused.…”
Section: Methodsmentioning
confidence: 99%
“…The pull test of the first bond was performed with a test length of 50 mm, yielding a strain rate of 5 × 10 −3 s −1 . Moreover, to better understand the differences between the Al-0.5Si and ZAS wires, current tests of the first bond (FAB) were compared [12][13][14][15][16], and a bias tensile test of the wires with different currents was performed. The schematic diagram in Figure 2 shows that, for the current test, the effective wire length was 30 mm, and the applied DC voltage increased at 0.05 V/sec from 0 V until the wire fused.…”
Section: Methodsmentioning
confidence: 99%
“…Moreover, to better understand the differences between the Al-0.5Si and ZAS wires, current tests of the first bond (FAB) were compared [10][11][12][13][14] and the bias-tensile test of the wires with different currents was measured. The schematic diagram in Fig.…”
Section: Methodsmentioning
confidence: 99%
“…13b illustrates a TEM image of the interface between the annealed Ag-2Pd wire and the Al pad. After the bias test for 24 h, EDS analysis showed that Pd atoms were detected in both the ball bond and interface layer [11,13]. Furthermore, the result showed approximately 1.71 at.% Pd in the ball bond matrix as well as elemental Pd in the interface layer.…”
Section: Fab/haz Of Annealed Ag-2pd Wirementioning
confidence: 97%