Effect of the angle of inclination of a plate shield on the thermal and hydraulic performance of a plate-fin heat sink

Tsai, Go-Long; Li, Hung-Yi; Lin, Chien-Cheng

doi:10.1016/j.icheatmasstransfer.2010.01.002

Cited by 25 publications

(8 citation statements)

References 13 publications

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“…Porous medias such as micro tubes [ 15 , 16 ], sintered metal [ 17 , 18 ] and metal foam [ 19 , 20 ] are very popular fin materials in research because they have very large convection area. The orientation direction of the heat sink in application [ 21 , 22 ] and airflow condition [ 23 , 24 ] were also found to have impact on cooling efficiency.…”

Section: Introductionmentioning

confidence: 99%

Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices

You

Zhang

Tao³

et al. 2021

Micromachines

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Heat sinks are widely used in electronic devices with high heat flux. The design and build of microstructures on heat sinks has shown effectiveness in improving heat dissipation efficiency. In this paper, four kinds of treatment methods were used to make different microstructures on heat sink surfaces, and thermal radiation coating also applied onto the heat sink surfaces to improve thermal radiation. The surface roughness, thermal emissivity and heat dissipation performance with and without thermal radiation coating of the heat sinks were studied. The result shows that with an increase of surface roughness, the thermal emissivity can increase up to 2.5 times. With thermal radiation coating on a surface with microstructures, the heat dissipation was further improved because the heat conduction at the coating and heat sink interface was enhanced. Therefore, surface treatment can improve the heat dissipation performance of the heat sink significantly by enhancing the thermal convection, radiation and conduction.

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Section: Introductionmentioning

confidence: 99%

Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices

You

Zhang

Tao³

et al. 2021

Micromachines

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“…They reported that the increase in perforation number caused higher thermal performance. Tsai et al (2010) numerically presented the impact of the plate shield inclination on the performance of a PFHS. A plate shield was designed to decrease the air bypass effect.…”

Section: Introductionmentioning

confidence: 99%

Thermal performance investigation of a plate fin heat sink equipped with twisted tape and perforated twisted tape

Nilpueng

2021

JTST

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Thermal performance investigation of a plate fin heat sink equipped with twisted tape and perforated twisted tape Abstract The concept of heat transfer enhancement in a plate fin heat sink (PFHS) using twisted tape is presented. The airflow behavior in the flow channel and heat sink performance are investigated at the Reynolds numbers between 2000 and 5000. The twisted tape and perforated twisted tape with twist ratio between 2.5 and 3.5 are equipped between the fins of the PFHS. For perforated twisted tape, the holes are drilled along the twisted tape length with the ratio of perforation diameter to twisted taped width (d/W) between 0.2 and 0.6. The heat transfer coefficient and pressure drop are enhanced by decreasing the twist ratio and increasing the Reynolds number and the d/W ratio between 0.2 and 0.4. However, they are dropped when the d/W ratio higher than 0.4. The highest thermal performance factors of the plate fin heat sink equipped with twisted tape (PFHSTT) and the plate fin heat sink equipped with perforated twisted tape (PFHSPTT) are 1.28 and 1.33, respectively. The correlations of the Nusselt number and friction factor related to twist ratio and d/W ratio are generated and proposed for designing and selecting in the future.

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“…El-Sayed et al [3] studied the heat transfer and fluid flow of a plate-fin heat sink for the cases of parallel flow, impinging flow and reverse impinging flow; a parallel flow yields the greatest rate of heat transfer and the least pressure drop. Tsai et al [4] Universal Journal of Mechanical Engineering 3(1): 12-20, 2015 13 investigated the effect of the angle of inclination of a plate heat shield on the thermal and hydraulic performance of a plate-fin heat sink. The research discovered that the sloping baffle is unable to reduce the thermal resistance, but can actually reduce the pressure drop effectively.…”

Section: Introductionmentioning

confidence: 99%

Heat Transfer Analysis of Plate-fin Heat Sink with Piezoelectric Fan

Chang¹,

Lin²,

Huang³

et al. 2015

ujme

Self Cite

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Applying software Ansys-Fluent to analysis the effect of piezoelectric fan device installed inside rectangular channel by numerical simulation method. The piezoelectric fan is activated by reversible piezoelectric effect in piezoelectric material, change rectangular channel flow field construction, then it affects heat flow status in advance. Numerical simulation parameter are included Nusselt number (Nu), distance between peak of fan blades to front part of heat sink (L g =0, 5, 10, -11.25, -22.5, -33.75, -45), height from center on piezoelectric fan bottom side (H w =10, 16, 21), number of piezoelectric fan (single-fan and twin-fan), phase-shift (in-phase and counter-phase), and numbers (n=10, 14) for heat sink fin. This result is indicated that good position to temperature dropped greatly is located from the front part of piezoelectric fan to the front of heat sink (L g = -22.5) under fixes distance (H w = 21) from piezoelectric fan to channel also found to provide double piezoelectric fan heat drop effect is equal to single one, however, double piezoelectric fans would provide higher heat dissipation as Counter-phase. The performance of piezoelectric fan is improved depends on change height (H w ) from center of piezoelectric fan to channel bottom; the height (H w ) shall be decreased as piezoelectric fan placement at the front of heat sink.

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Effect of the angle of inclination of a plate shield on the thermal and hydraulic performance of a plate-fin heat sink

Cited by 25 publications

References 13 publications

Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices

Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices

Thermal performance investigation of a plate fin heat sink equipped with twisted tape and perforated twisted tape

Heat Transfer Analysis of Plate-fin Heat Sink with Piezoelectric Fan

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