Effect of the alumina micro-particle sizes on the thermal conductivity and dynamic mechanical property of epoxy resin

Abstract

Epoxy thermal conductive adhesives with high thermal conductivity and dynamic mechanical properties are important thermally conductive materials for fabricating highly integrated electronic devices. In this paper, micro-Al2O3 is used as a thermally conductive filler for the epoxy resin composite and investigated the effect of micron-sized alumina particle size on the thermal conductivity and dynamic mechanical property of epoxy resin by the transient planar hot plate method and DMA (Dynamic mechanical analysis). The experimental results show that with the same amount of alumina filling, the thermal conductivity and Tg (glass transition temperature) of epoxy/Al2O3 composite material decrease with the increase of alumina particle size. The maximum thermal conductivity of the composite material is 0.679 (W/mK), while the energy storage modulus of epoxy/Al2O3 composite material increases with the increase of alumina particle size, and the maximum energy storage modulus of the composite material is 160MPa. Compared with pure epoxy resin, the thermal conductivity and energy storage modulus have increased by 2.7 and 3.2 times, respectively. The epoxy/Al2O3 composite was applied to the COB (Chips On Board) type LED package, and the substrate temperature of the LED dropped to the lowest after 1.5 hours of operation using EP-A5 composite, and the temperature was stabilized at 38.2°C, indicating that the addition of 5-micron alumina composite has the best heat dissipation in the COB type LED package. These results are critical for the implementation of particulate-filled polymer composites in practical applications because relaxed material specifications and handling procedures can be incorporated in production environments to improve efficiency.

Fabrication and Characterization of Al2O3-Siloxane Composite Thermal Pads for Thermal Interface Materials

“…However, there might be an increase in the heat generated by electronic devices during operation because of these innovations. Thermally conductive materials (TCMs) are used to ensure good heat transfer characteristics in electronic devices [1]. Among the different types of TCMs, thermally conductive adhesives, such as epoxy resins, are widely used in electronic devices because of their advantages, such as ease of processing, simple fabrication, low cost, and thermal stability [1].…”

“…Thermally conductive materials (TCMs) are used to ensure good heat transfer characteristics in electronic devices [1]. Among the different types of TCMs, thermally conductive adhesives, such as epoxy resins, are widely used in electronic devices because of their advantages, such as ease of processing, simple fabrication, low cost, and thermal stability [1]. The thermal conductivity of epoxy resins is very low, and it may be improved by filling the epoxy resin with ceramic, carbon, and metal particles [1].…”

“…Among the different types of TCMs, thermally conductive adhesives, such as epoxy resins, are widely used in electronic devices because of their advantages, such as ease of processing, simple fabrication, low cost, and thermal stability [1]. The thermal conductivity of epoxy resins is very low, and it may be improved by filling the epoxy resin with ceramic, carbon, and metal particles [1]. However, incorporating metal particles deteriorates the electrical insulating and dielectric properties of these composites, thereby limiting their application to electronic packaging.…”

“…Although carbon materials offer advantages such as high thermal conductivity and lightweight characteristics, their high cost and low electrical insulation properties limit their practical applications in industry. Ceramic particles provide excellent thermal conductivity and mechanical properties compared to carbon materials and metal particles, and, therefore, they have been extensively studied [1]. Ceramic materials are widely used in various fields of engineering, such as electronics, optics, metallurgy, and biomedicine [1,2].…”

“…Ceramic particles provide excellent thermal conductivity and mechanical properties compared to carbon materials and metal particles, and, therefore, they have been extensively studied [1]. Ceramic materials are widely used in various fields of engineering, such as electronics, optics, metallurgy, and biomedicine [1,2]. Among them, Al 2 O 3 is an attractive material for fabricating thermally conductive composite thermal pads because of its advantages, including high thermal conductivity, low cost, and stable chemical properties.…”