2021
DOI: 10.1007/s10854-021-06753-1
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Effect of the Al2O3 interfacial layer thickness on the measurement temperature-induced I–V characteristics in Au/Ti/Al2O3/n-GaAs structures

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Cited by 7 publications
(4 citation statements)
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“…To investigate the conduction mechanism in AlB10 and facilitate the development of filmbased devices with an Al-AlB10-nSi structure, the current-voltage characteristics (I-V curves) were examined [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25].…”
Section: The Methodology and Experimental Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…To investigate the conduction mechanism in AlB10 and facilitate the development of filmbased devices with an Al-AlB10-nSi structure, the current-voltage characteristics (I-V curves) were examined [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25].…”
Section: The Methodology and Experimental Resultsmentioning
confidence: 99%
“…the Фb0 values for the asdeposited and MIS diode were found as 0.77 and 0.73 eV at 300 K. That is, the Фb0 value for the D1 MIS diode at 300 K is lower than that for the as deposited. The case may be ascribed to the passivation effect of the Al2O3 thin film on interface defects to improve the interface inhomogeneity [9,10,12,33,[15][16][17][18][19][20]. They [22] experimentally found that the Фb0 value decreased with increase in the interfacial Al2O3 thinfilm thickness from as-deposited diode to 2 nm over whole test temperature (five different temperatures).…”
Section: Discussionmentioning
confidence: 98%
“…In order to determine the performances of the two fabricated photodiodes, current-voltage measurements were carried out under different light intensities and dark conditions. There are different approaches that can be effective in the current conduction mechanism in such devices, and the important ones can be listed as follows: thermionic emission, thermionic field emission, and tunneling of electronic charges [37,38]. Some of these are considered insignificant, while others may be dominant.…”
Section: Devices Characterizationmentioning
confidence: 99%
“…A Gaussian distribution of the Schottky barrier over the contact area has been also assumed to describe the inhomogeneities [15]. Several approaches have been adopted to reduce interface states including the insertion of an interfacial layer between the metal and the semiconductor [16][17][18]. Other treatments were also considered.…”
mentioning
confidence: 99%