2016
DOI: 10.5185/amlett.2016.6213
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Effect Of TETA Microcapsules On Self-healing Ability Of Dual Component Epoxy System

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Cited by 5 publications
(4 citation statements)
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“…Figure 2a shows that the SNR value increases as the temperature increases from 25 to 40°C followed by a decrease as we further increase the temperature from 40 to 85°C. In general, in solvent evaporation method the quick evaporation of solvent significantly affects the surface morphology of the microcapsules [20]. Hence, an increase in the reaction temperature leads in the formation of deep pores on the surface of microcapsules.…”
Section: Results and Discussion 31 Snr Analysismentioning
confidence: 99%
See 1 more Smart Citation
“…Figure 2a shows that the SNR value increases as the temperature increases from 25 to 40°C followed by a decrease as we further increase the temperature from 40 to 85°C. In general, in solvent evaporation method the quick evaporation of solvent significantly affects the surface morphology of the microcapsules [20]. Hence, an increase in the reaction temperature leads in the formation of deep pores on the surface of microcapsules.…”
Section: Results and Discussion 31 Snr Analysismentioning
confidence: 99%
“…Therefore, there is a need to develop new shell wall material for the preparation of such microcapsules. The use of poly(methyl methacrylate) (PMMA) polymer as a potential shell wall material in microencapsulation process of such microcapsules has been reported in the literature [17][18][19][20][21]. Li et al [17] first introduced the preparation of curing agent and epoxy loaded PMMA microcapsules by solvent evaporation technique for the development of polymeric self-healing composites.…”
Section: Introductionmentioning
confidence: 99%
“…Using modern mixing technology, microcapsules loaded with repair agents were easily able to bond to the polymer matrix 5–8 . If there was mechanical damage in the microcapsule, both the repair agent and the hardener would flow out of the broken microcapsule to fill the damaged area and extend the service life of the material 9–11 …”
Section: Introductionmentioning
confidence: 99%
“…[5][6][7][8] If there was mechanical damage in the microcapsule, both the repair agent and the hardener would flow out of the broken microcapsule to fill the damaged area and extend the service life of the material. [9][10][11] Epoxy resin was widely used in various fields because of its excellent physical and mechanical properties, electrical insulation properties and bonding properties with various materials. 12,13 Epoxy resin based epoxyamine repair system had become one of the commonly used repair systems because of its good substrate compatibility and fast repair speed.…”
Section: Introductionmentioning
confidence: 99%