2022
DOI: 10.1016/j.microrel.2022.114824
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Effect of temperature on vibration durability of lead-free solder joints

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Cited by 4 publications
(1 citation statement)
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“…In general, LCF refers to the phenomenon of structural degradation and eventual failure of a material subjected to cyclic loading at relatively high stress levels, typically below the material's yield strength (Su et al , 2019). In the context of tin-silver-copper (SAC) solder joints, LCF manifests as the accumulation of damage and the eventual formation of cracks, leading to failure under cyclic loading conditions (Höhne et al , 2022). The importance of understanding and mitigating LCF in SAC solder joints cannot be overstated, as it directly affects the long-term reliability and performance of electronic instruments.…”
Section: Introductionmentioning
confidence: 99%
“…In general, LCF refers to the phenomenon of structural degradation and eventual failure of a material subjected to cyclic loading at relatively high stress levels, typically below the material's yield strength (Su et al , 2019). In the context of tin-silver-copper (SAC) solder joints, LCF manifests as the accumulation of damage and the eventual formation of cracks, leading to failure under cyclic loading conditions (Höhne et al , 2022). The importance of understanding and mitigating LCF in SAC solder joints cannot be overstated, as it directly affects the long-term reliability and performance of electronic instruments.…”
Section: Introductionmentioning
confidence: 99%