Effect of temperature on the photosensitivity of a photoresist (AZ 1350J)

Gupta, Tarakranjan

doi:10.1016/0014-3057(81)90173-7

Cited by 11 publications

(2 citation statements)

References 9 publications

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“…The average lifetime, reliability, and time to failure of various electrical and electromechanical systems depend on temperature [1]. Semiconductor device fabrication processes are also prone to changes in temperature and are thus carried out in a controlled ambience [2][3][4]. Scanning probe lithography (SPL) techniques are a new domain of nanolithography techniques which utilize the confinement of various physical phenomena under a sharp tip.…”

Section: Introductionmentioning

confidence: 99%

Decrypting the thermal effects on the electric field-induced material formation process on Cr thin films

Ghosh,

Talukder

2023

Phys. Scr.

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Controlled electrochemical reactions on chromium (Cr) thin films have been employed to create micro- and nano-scale patterns using a scanning probe-based patterning process called electrolithography (ELG). The electrochemical reaction produces a liquid material. The ELG process, being a local anodic oxidation-based technique, is significantly affected by several factors, including various ambient conditions. In this article, we explore the effects of temperature on the said electrochemical reaction-induced liquid material formation process. Keeping other ambient conditions constant, the temperature is varied over a large range, and we observe that a 40 °C change in temperature results in a 20-time change in the radial spread of the liquid region. This observation is thereafter explained by the effect of temperature on three different parameters affecting the rate of electrochemical reaction. Thus, based on this study, we can say that temperature is one of the most crucial parameters which can be used to confine the lateral spread of the formed liquid region and thereby improve the resolution of the patterns created using the ELG technique.

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Section: Introductionmentioning

confidence: 99%

Decrypting the thermal effects on the electric field-induced material formation process on Cr thin films

Ghosh,

Talukder

2023

Phys. Scr.

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“…1), which is rapidly converted to an acid (A) if water is present in the film, or to an ester (E) in the absence of water, by reaction with the resin. 2 The principle behind a novolak/DNQ resist is the formation of acid caused by exposure which, in turn, results in increased dissolution. Ester formation, on the other hand, can actually decrease the dissolution rate due to cross-linking, which increases the molecular weight (Mw) of the resin.…”

Section: Introductionmentioning

confidence: 99%

Effect of Humidity on Photoresist Performance

Bruce

Dupuis

Gleason

et al. 1997

J. Electrochem. Soc.

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This paper discusses the effect of varied humidity on lithographic performance during photoresist exposure. In the presence of water, exposure causes the sensitizer to be converted into acid; without water, a less soluble ester forms. The effect of humidity on the resist chemistry was measured using infrared spectroscopy. To completely convert the sensitizer to acid, humidities exceeding 40% were needed. At lower humidities, significant amounts of ester, rather than acid, were formed. The effect of humidity during exposure was also measured using lithographic techniques. As humidity decreased from 40 to 20%, the dissolution rate decreased by up to 65%, dose-to-clear (E 0 ) increased by up to 25%, the dose-to-print increased by up to 15%, and contrast decreased by up to 10%. The magnitude of these effects was resistdependent. The time of equilibration of water into and out of the resist film was less than 30 s.

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Pattern Generation

Gupta

2009

Copper Interconnect Technology

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Effect of temperature on the photosensitivity of a photoresist (AZ 1350J)

Cited by 11 publications

References 9 publications

Decrypting the thermal effects on the electric field-induced material formation process on Cr thin films

Decrypting the thermal effects on the electric field-induced material formation process on Cr thin films

Effect of Humidity on Photoresist Performance

Pattern Generation

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