Transient Liquid Phase (TLP) bonding was performed between Mg-AZ31 and Ti-6Al-4V alloys with various bonding temperatures using Cu coatings and Sn interlayers. The bonding parameters such as bonding pressure and bonding time were fixed at 1 MPa and 15 minutes respectively in order to study the effect of bonding temperature on the joint evolution. Bonds made at temperatures of 540, 560, 580 and 600 C showed good bond strength. The obtained bonds were investigated by Electron Probe Micro-analyzer EPMA and showed reaction layers and diffusion zones for all bonds made. The maximum joint shear strength of 78 MPa was obtained for bond made at 580 C. X-ray diffraction XRD and X-ray photoelectron spectroscopy XPS were taken for the fractured surfaces of bond made at 580 C. The analysis of the fractured surfaces found that the reaction layer contains Sn5Ti6 IMC in the titanium side and Mg2Cu IMC in the magnesium side where the fracture occurs at the diffusion zone in the mg side.