Effect of temperature on electronucleation and growth mechanism of Zn–Ni alloy in deep eutectic solvent

Abstract

Purpose The purpose of this paper is to study the effect of temperature on Zn–Ni alloys in ChCl–Urea. Design/methodology/approach Based on cyclic voltammetry experiments, the deposition behavior and kinetics of the Zn–Ni alloy are studied. The nucleation process of the Zn–Ni alloy is studied in detail via chronoamperometry experiments. The effects of the deposition temperature on the microstructure, Ni content and phase composition of Zn–Ni alloy coatings are investigated via scanning electron microscopy and X-ray diffraction (XRD) combined with classical thermodynamics. Findings The results show that with increasing temperature, the reduction peak shifts toward a more positive electric potential, which is beneficial for the co-electric deposition process, and the diffusion coefficient is estimated. With increasing temperature, the nucleation process of the Zn–Ni alloy becomes a three-dimensional instantaneous nucleation, the typical kinetic parameters are determined using the standard 3D growth proliferation control model and the Gibbs free energy is estimated. The Zn–Ni alloy coatings are prepared via normal co-deposition. With increasing temperature, the degree of crystallinity increases, the coating gradually becomes uniform and compact and the XRD peak intensity increases. Originality/value The nucleation process of the Zn–Ni alloy at different temperatures is analyzed. The diffusion coefficient D and Gibbs free energy are calculated. The contribution of the three processes at different temperatures is analyzed. The effect of temperature on the morphology of the Zn–Ni alloy coatings is studied.

Electrodeposition of Nanostructured Co–Cu Thin Alloy Films on to Steel Substrate from an Environmentally Friendly Novel Lactate Bath under Different Operating Conditions

“…This reduces the concentration type of polarization [23]. Each polarization curve shows a distinct peak (I) at −1.3 V. The deposition process was controlled by the diffusion process because the current density declines after the cathodic peak (I) [67,68].…”