Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

Abstract

In this study, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10−5 s−1 to 10−1 s−1 over a wide temperature range from −40°C to 125°C to study the effect of strain rate and testing temperature on the mechanical properties in a systematic manner. Based on these experimental data, a set of empirical formulae was derived by a statistical method to describe the effect of temperature and strain rate in a quantitative manner and explain the variation in the mechanical properties published in other reports. It is concluded that the empirical formulae can be used to characterize the mechanical properties of 63Sn/37Pb over a wide range of temperatures and strain rates.

Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part I: Creep constitutive relation and fatigue model

“…The simple Arrhenius power-law constitutive relation [171 was used to describe the steady-state creep strain rate d%r/dt of Sn-Pb solders in terms of the applied shear stress T, as shown below d~fcr/dt ~-dTnexp (-Q) (1) where n is the stress exponent, Q is the activation energy, T is the absolute temperature, R is Boltzmann's constant, and A is a constant.…”

“…(4) was used to calculate the Q values at any tested shear stress and temperature. In the analysis, the shear stress was normalized by the shear modulus G, given by [1] G --(24 782 -39.63T) MPa…”

“…Surface mount solder attachment plays an important role in BGA packages since the solder joints not only provide the electrical interconnection but are also the sole mechanical attachment of the electronic components to the printed circuit board (PCB). However, the stresses caused by the temperature gradients and the cyclic temperature fluctuations constitute a condition of viscous creep flow for a constrained solder joint [1]. At the same time, the constrained solder joints are cycled between the maximum and minimum temperature limits depending on the environment.…”

Constitutive Modeling of Viscoplastic Damage in Solder Material

“…For a reliability analysis, knowledge on the mechanical behavior of solder joints under thermomechanical loading is necessary. In past decade, many researchers have studied constitutive modeling and reliability of solder joints (Solomon, 1986, Busso, et al, 1994, McDowell, et al, 1994, Shine, et al, 1994, Frear, et al, 1997, Lau, et al, 1997and Shi, et al 1999. However, the previous work focuses on either the experimental results or the conventional analytical approaches based on the assumption that all materials are perfect or defects-free during a loading process.…”

Effects of Temperature and Strain Rate on Commercial Aluminum Alloy AA5083

“…The publised experimental data is useful to derive the related properties of this material which then allows for further investigation via relevant simulation model. The most applicable testing procedure for material characterization is uniaxial tensile testing due to its simplicity and cost effective [6]. This test allows for evaluation of flow stress, elongation and cavity volume fraction at various temperatures and strain rates [7].…”