2000
DOI: 10.1111/j.1365-2842.2000.00614.x
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Effect of temperature and flux concentration on soldering of base metal

Abstract: The present study used the acoustic ing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and showed no significant difference according to either mechanical or acoustic results. But in the 1200°C the resultant ultimate tensile strength (UTS). Scangroup, the UTSs and AE counts showed significant ning electron microscopy (SEM) was used to examine fracture surfaces of the solde… Show more

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Cited by 3 publications
(4 citation statements)
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References 21 publications
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“…During crack propagation, most NRC specimens had limited AE activity -indicating that few events occurred within the specimens at fracture 36) . NRC specimens were composed of composite material only with no fiber addition, hence fewer microcracks were expected to occur.…”
Section: Discussionmentioning
confidence: 99%
“…During crack propagation, most NRC specimens had limited AE activity -indicating that few events occurred within the specimens at fracture 36) . NRC specimens were composed of composite material only with no fiber addition, hence fewer microcracks were expected to occur.…”
Section: Discussionmentioning
confidence: 99%
“…19 Porosity in solder joints may be produced by flux entrapment due to over-fluxing and under-heating, in addition to wetting ability of molten solder in solder gap space ( Figure 3 ). 1 , 3 , 18 …”
Section: Discussionmentioning
confidence: 99%
“…Procedures such as long-span fixed partial dentures, repair of clasps and frameworks, addition of wrought wire clasps in removable prostheses, and the superstructures of dental implants all need soldering to improve accuracy and solve fitting problems. 1 Two main methods are available for soldering: 2 preceramic and postceramic soldering, which are done before and after porcelain application, respectively. Preceramic soldering is often performed at a temperature very close to the melting point of parent metals, but postsolder melts below the pyroplastic range of the porcelain, which is considerably lower than the melting point of the parent metal.…”
Section: Introductionmentioning
confidence: 99%
“…During soldering, the parental metal surface should retain its non-oxidized status and absence of impurities in order to form a tight contact between the solder and the parental soldered surface. (23)…”
Section: Radiographic Analysis Of the Joints Joined With Stainless Stmentioning
confidence: 99%