Effect of surface finishes on electromigration reliability in eutectic Sn–58Bi solder joints

Kim, Jae‐Ha; Lee, Young-Chul; Lee, Sang‐Min; Jung, Seung‐Boo

doi:10.1016/j.mee.2013.12.006

Cited by 31 publications

(4 citation statements)

References 16 publications

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“…In the past, the tin-lead solder was commonly used due to its good wettability and low melting point [1][2][3][4][5], but due to the consideration of environmental protection, this toxicity solder was forbidden to use by the regulation of hazardous substances (RoHS) and gradually replaced by lead-free solders in modern electronics industries [6][7][8][9][10]. As a kind of conventional lead-free solder, the Sn-58Bi has drawn a great deal of attention in the field of research owing to its excellent properties, such as the relatively low melting point (138 °C), superior creep resistance and high tensile strength [11][12][13][14]. Zhang et al have systematically investigated the shear and creep-fatigue fracture behaviors of the Sn-58Bi/Cu joints, and in the in situ observation, no micro-crack was produced in the solder under shear stress, indicating that the Sn-58Bi solder showed excellent ductility in the solder joints [15].…”

Section: Introductionmentioning

confidence: 99%

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Cheng

et al. 2020

Appl. Phys. A

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In the current investigation, various mass fractions (0, 0.5, 1.5, 5 and 10 wt%) of Ni were doped into Cu substrate, and influences of Ni addition on the microstructure evolution and mechanical property of the Sn-58Bi/Cu-xNi solder joint were investigated. Results showed that the growth rate of intermetallic compound (IMC) would increase with the Ni addition added from 0 to 5 wt% and remarkably decreased for Sn-58Bi/Cu-10Ni joint system. It indicated that the growth rate of IMC layer would decrease when 10 wt% Ni was added into the alloy. Besides, the tensile strength reduced with increase in the IMC thickness, which was under the synergistic effect of increasing liquid-state reaction time and the content of Ni addition (0-5 wt%). Moreover, the fracture mechanism gradually transformed from ductile fracture mode to brittle fracture mode with the decrease in joint strength.

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Section: Introductionmentioning

confidence: 99%

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Cheng

et al. 2020

Appl. Phys. A

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“…The electronics industry continuously demands miniaturization combined with high integration in electronic devices, e.g., power modules and printed circuit boards [1][2][3]. Meeting these demands can lead to an increase in the current density of devices [4,5].…”

Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints

et al. 2019

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Thermal fatigue generally occurs in ultrasonically bonded copper joints in electronic devices as the bonding substrate is composed of plural materials, leading to differences in the coefficient of thermal expansion. In this study, we found that the thermal fatigue resistance of the ultrasonically bonded copper joints was influenced by the grain size and hardness of the bonding substrate through the evaluation of the thermal fatigue properties. Copper alloys C1020 and C1940 were used as substrate materials to investigate the influence of the initial properties of the bonding material on the thermal fatigue resistance. We evaluated the crack propagation due to thermal fatigue via thermal cycle tests. Microstructural observations of the region fractured because of thermal fatigue revealed that cracks resulting from thermal fatigue did not progress in the fine grain region formed at the bonded interface. It was inferred that grain boundaries were an obstacle to crack propagation. C1940 has higher hardness and finer grains than C1020, and showed a lower decreasing rate of the peel strength and bonding area after the thermal cycling test than C1020 joints. Thus, a hard copper material with fine grains is effective in suppressing thermal fatigue fracture of ultrasonically bonded copper joints.

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“…Under such a current density, the metallic atoms are migrated with the current ow. In Sn-Bi/Cu solder joint, phase separation in the solder and Bi segregation to the interface were always produced at the anode after electromigration [9][10][11] . The interfacial embrittlement induced by Bi segregation will deteriorate the reliability of solder joint 12) .…”

Section: Introductionmentioning

confidence: 99%

Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration

et al. 2017

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Minor Zn was alloyed into Cu substrate to improve the electromigration reliability of Sn-58Bi/Cu solder joints in this paper. Electromigration behavior of Sn-58Bi/Cu and Sn-58Bi/Cu-4.89Zn was studied with the current density of 1.0 × 10 4 A/cm 2 from the microstructural evolution on the surface morphologies and the interior interfacial structure. In case of the surface morphologies in Sn-58Bi joints, the existence of Zn in Cu substrate effectively postponed the formation of Sn hillocks of whiskers at the anode side and the depletions/voids at the cathode side. From the observation of interior interfacial structure, Cu-Zn substrate obviously depressed Bi segregation and the growth of Bi-rich layer at the anode interface. Because Zn atoms were migrated from the anode to the cathode while Bi atoms were migrated from the cathode to the anode during electromigration, Zn atoms would ll the vacancies left behind by the migration of Bi atoms. The electromigration resistance of Sn-58Bi solder joints was correspondingly improved by Zn alloyed into Cu substrate. the calculated DZ * of Bi atoms in the Cu and Cu-4.89Zn substrate is 3.69 × 10 −11 cm 2 /s and 1.76 × 10 −11 cm 2 /s, which also illustrates there exists a slower diffusion rate for Bi atoms in Sn-58Bi solder joint with Cu-Zn substrate.

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Effect of surface finishes on electromigration reliability in eutectic Sn–58Bi solder joints

Cited by 31 publications

References 16 publications

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints

Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration

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