Effect of substrate properties and thermal annealing on the resistivity of molybdenum thin films

Schmid, U.; Seidel, H.

doi:10.1016/j.tsf.2005.05.003

Cited by 32 publications

(10 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Upon heating compressive stress is introduced in all films. The recrystallization temperature of Mo is > 900°C and therefore very little change in structural and electrical properties would be expected at temperatures below 650°C [18].…”

Section: -Power Density Effectmentioning

confidence: 99%

Electrical, morphological and structural properties of RF magnetron sputtered Mo thin films for application in thin film photovoltaic solar cells

et al. 2011

View full text Add to dashboard Cite

Molybdenum (Mo) thin films were deposited using radio frequency (RF) magnetron sputtering, for application as a metal back contact material in "substrate configuration" thin film solar cells. The variations of the electrical, morphological, and structural properties of the deposited films with sputtering pressure, sputtering power and post-deposition annealing were determined. The electrical conductivity of the Mo films was found to increase with decreasing sputtering pressure and increasing sputtering power. X-ray diffraction data showed that all the films had a (110) preferred orientation that became less pronounced at higher sputtering power while being relatively insensitive to process pressure. The lattice stress within the films changed from tensile to compressive with increasing sputtering power and the tensile stress increased with increasing sputtering pressure. The surface morphology of the films changed from pyramids to cigar-shaped grains for a sputtering power between 2 100 and 200 W, remaining largely unchanged at higher power. These grains were also observed to decrease in size with increasing sputtering pressure. Annealing the films was found to affect the resistivity and stress of the films. The resistivity increased due to the presence of residual oxygen and the stress changed from tensile to compressive. The annealing step was not found to affect the crystallisation and grain growth of the Mo films.

show abstract

Section: -Power Density Effectmentioning

confidence: 99%

Electrical, morphological and structural properties of RF magnetron sputtered Mo thin films for application in thin film photovoltaic solar cells

et al. 2011

View full text Add to dashboard Cite

show abstract

“…Data from [19] show the influence of substrate properties (e.g., roughness characteristics and chemical composition) on the electrical resistivity of Mo evaporated on silicon-based substrates vs. film thickness and post-deposition annealing temperatures up to~900 • C. A resistivity around 80-90 µΩ·cm, a value quite high according to the Fuchs-Sondheimer model [23], was obtained in these multiphase films. In [20,21] other Mo films with a thickness of 500 nm showed an electrical resistivity in the range 8-23 µΩ·cm, quite a low value, close to the resistivity of Mo bulk (5.46 µΩ·cm) [20,21].…”

Section: Resultsmentioning

confidence: 98%

“…In recent years several studies have been performed to characterize Mo films grown on flat substrates undergoing different thermal treatments [13][14][15][18][19][20][21]. As underlined in the introduction, molybdenum is an attractive coating material thanks to either its high thermal and electrical conductivity, or its excellent mechanical properties.…”

Section: Resultsmentioning

confidence: 99%

Materials and Breakdown Phenomena: Heterogeneous Molybdenum Metallic Films

et al. 2017

View full text Add to dashboard Cite

Technological activities to design, manufacture, and test new accelerating devices using different materials and methods is under way all over the world. The main goal of these studies is to increase the accelerating gradients and reduce the probability of radio-frequency (RF) breakdown. Indeed, it is still not clear why, by increasing the intensity of the applied field, intense surface damage is observed in copper structures, limiting the lifetime and, therefore, the practical applications. A possible solution is represented by a coating of a relatively thick layer of molybdenum in order to improve the breakdown rate. molybdenum can be reliably grown on different substrates with a negligible strain and, for thicknesses up to 600 nm, with a resistivity <100-150·µΩ cm. Moreover, Mo coatings with controlled composition, internal stress, and roughness may allow improving thermo-mechanical properties reaching values not attainable by uncoated copper. Although the Mo conductivity remains lower compared to Cu, a Mo coating represents a very interesting option for high gradient accelerator components manufactured in copper.

show abstract

“…Despite these changes to the multilayer nature of the films, the underlying columnar grain structure remained stable up 650 °C, which represents the typical temperature for the onset of grain growth in columnar nanocrystalline Mo thin films. [58] Disappearance of the Au-rich layers was accompanied by enhanced contrast of the underlying columnar grain structure, which suggests that diffusing Au atoms segregated to the grain boundaries. At 600 °C in Figure 4c, spherical clusters appeared to form in select regions of the fading Au-rich layers (indicated by red arrows), and these clusters became larger and elongated at the highest temperature of 650 °C in Figure 4d.…”

Section: Microstructural Stabilization By Grain Boundary Segregationmentioning

confidence: 99%

Unraveling Thermodynamic and Kinetic Contributions to the Stability of Doped Nanocrystalline Alloys using Nanometallic Multilayers

et al. 2022

View full text Add to dashboard Cite

Targeted doping of grain boundaries is widely pursued as a pathway for combating thermal instabilities in nanocrystalline metals. However, certain dopants predicted to produce grain‐boundary‐segregated nanocrystalline configurations instead form small nanoprecipitates at elevated temperatures that act to kinetically inhibit grain growth. Here, thermodynamic modeling is implemented to select the Mo–Au system for exploring the interplay between thermodynamic and kinetic contributions to nanostructure stability. Using nanoscale multilayers and in situ transmission electron microscopy thermal aging, evolving segregation states and the corresponding phase transitions are mapped with temperature. The microstructure is shown to evolve through a transformation at lower homologous temperatures (<600 °C) where solute atoms cluster and segregate to the grain boundaries, consistent with predictions from thermodynamic models. An increase in temperature to 800 °C is accompanied by coarsening of the grain structure via grain boundary migration but with multiple pinning events uncovered between migrating segments of the grain boundary and local solute clustering. Direct comparison between the thermodynamic predictions and experimental observations of microstructure evolution thus demonstrates a transition from thermodynamically preferred to kinetically inhibited nanocrystalline stability and provides a general framework for decoupling contributions to complex stability transitions while simultaneously targeting a dominant thermal stability regime.

show abstract

Effect of substrate properties and thermal annealing on the resistivity of molybdenum thin films

Cited by 32 publications

References 25 publications

Electrical, morphological and structural properties of RF magnetron sputtered Mo thin films for application in thin film photovoltaic solar cells

Electrical, morphological and structural properties of RF magnetron sputtered Mo thin films for application in thin film photovoltaic solar cells

Materials and Breakdown Phenomena: Heterogeneous Molybdenum Metallic Films

Unraveling Thermodynamic and Kinetic Contributions to the Stability of Doped Nanocrystalline Alloys using Nanometallic Multilayers

Contact Info

Product

Resources

About