EFFECT OF STIRRING RATE ON ELECTROCHEMICAL CODEPOSITION OF Ni-SiC COMPOSITE

Hamal, Kailash; Rajbhandari, Armila; Gyawali, Gobinda; Lee, Soo Wohn

doi:10.3126/sw.v12i12.13567

Cited by 2 publications

(1 citation statement)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Moreover, for the dispersion of TiO 2 , the acidic pH (~3.5) provided better results. [73] The particle content in the composite also behaved in the similar way. They correlated this to the fact that SiO 2 has a negative zeta potential from pH 2-11.…”

Section: Bath Temperature and Phmentioning

confidence: 50%

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Sharma¹,

Das²,

Das³

2016

Electrodeposition of Composite Materials

View full text Add to dashboard Cite

This chapter provides a detailed overview of the various Sn-based composites solders reinforced with ceramic nanoparticles. These solders are lead free in nature and are produced by various process like powder metallurgy, ball milling, casting as well as simple and economic pulse co-electrodeposition technique. In this chapter, various electrodeposited composite solders, their synthesis, characterization, and evaluation of various properties for microelectronic packaging applications, such as microstructure, microhardness, density and porosity, wear and friction, electrochemical corrosion, melting point, electrical resistivity, and residual stress of the monolithic Sn-based and (nano)composite solders have been presented and discussed. This chapter is divided into the following sections: such as introduction to microelectronic packaging, synthesis routes for solders and composites, various nanoreinforcement, and the mechanism of incorporation in solder matrix, the pulse co-electrodeposition technique, the various factors affecting composite deposition, and the improved properties of composite solders over monolithic solders for microelectronic packaging applications are also summarized here.

show abstract

Section: Bath Temperature and Phmentioning

confidence: 50%

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Sharma¹,

Das²,

Das³

2016

Electrodeposition of Composite Materials

View full text Add to dashboard Cite

show abstract

Effect of Current Density on Properties Of Nickel-Silicon Carbide Composites

Hama

Nyachhyon

Gyawali

et al. 2016

J. Inst. Sci. Tech.

Self Cite

View full text Add to dashboard Cite

Nickel-Silicon Carbide (Ni-SiC) composite coating has been prepared by two electrode electrochemical codeposition technique in nickel sulfamate bath. The Cetyltrimethylammonium bromide (CTAB) was added in bath as cationic surfactant whereas saccharine as a grain modifier. The effect of current density during deposition was systematically studied and optimized to get homogeneous surface texture with utmost microhardness and deprived coefficient of friction. The result revealed that 60 mA/cm 2 current density was found to be the optimum current density which showed the highest microhardness of 590 ± 10 Hv and lowest coefficient of friction with regular surface morphology.

show abstract

EFFECT OF STIRRING RATE ON ELECTROCHEMICAL CODEPOSITION OF Ni-SiC COMPOSITE

Cited by 2 publications

References 25 publications

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Effect of Current Density on Properties Of Nickel-Silicon Carbide Composites

Contact Info

Product

Resources

About