Effect of Solder Joint Length on Fracture Under Bending

Akbari, Saeed; Nourani, Amir; Spelt, J.K.

doi:10.1007/s11664-015-4133-6

Cited by 8 publications

(7 citation statements)

References 26 publications

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“…This difference is insignificant in the predicted load since J ci is almost proportional to square of the applied load. It is worth noting that J ci s reported throughout the rest of the text are the values obtained from a precrack modelled in the middle of the solder layer as done in Nourani et al, 1 Nourani and Spelt, 6 Nourani and Spelt, 8 Akbari et al, 9 Nourani and Spelt, 10 Nadimpalli and Spelt, 11 and Nadimpalli and Spelt. 19 The average critical strain energy release rate for crack initiation, J ci , however, decreased significantly (ie, about 60% from 1024 to 404 J/m 2 ) when the adherend thickness increased from 8 to 14 mm.…”

Section: Resultsmentioning

confidence: 99%

“…DCB specimens of 2.5‐mm‐long solder joints were prepared as described in Nourani et al, Nourani and Spelt, Akbari et al, Nourani and Spelt, and Nadimpalli and Spelt Copper bars of C110 alloy were cut to the dimensions indicated in Figure . Milling process with a depth of 0.2 mm was performed on the surfaces to be soldered in order to eliminate the roundness of the original copper bars.…”

Section: Methodsmentioning

confidence: 99%

“…A piece of bleached cheese cloth was used to wipe out any dirt remained on the surfaces. This procedure produced an organic solderablility preservative (OSP) surface finish . The soldering process was done on a hot plate with a constant temperature of 220°C, almost equal to the melting point of the flux‐cored Sn3.0Ag0.5Cu (SAC305) solder wire.…”

Section: Methodsmentioning

confidence: 99%

“…The copper bars were clamped together against the steel wires with a thickness equal to the desired thickness of the solder joints (ie, 250 μm). Time above liquidus (TAL), measured right after the soldering process started, was adjusted to be 120 seconds as done in Nourani et al, Nourani and Spelt, Akbari et al, Nourani and Spelt, and Nadimpalli and Spelt. Consistent with Nourani et al, Nourani and Spelt, Akbari et al, and Nourani and Spelt, the specimen was cooled in a small wind tunnel with a cooling rate of 1.4 to 1.6°C/second, which is typical of microelectronic manufacturing .…”

Section: Methodsmentioning

confidence: 99%

“…This procedure produced an organic solderablility preservative (OSP) surface finish. 1,[8][9][10][11] The soldering process was done on a hot plate with a constant temperature of 220°C, almost equal to the melting point of the flux-cored Sn3.0Ag0.5Cu (SAC305) solder wire. A high-temperature-resistant Kapton tape was used to mask the surfaces not to be soldered.…”

Section: Specimen Preparationmentioning

confidence: 99%

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Predicting fracture of solder joints with different constraint factors

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et al. 2018

Fatigue Fract Eng Mat Struct

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Double cantilever beam (DCB) specimens of 2.5‐mm‐long SAC305 solder joints were prepared with thickness of copper adherends varying from 8 to 21 mm each. The specimens were tested under mode I loading conditions (ie, pure opening mode with no shear component of loading) with a strain rate of 0.03 second−1. The measured fracture load was used to calculate the critical strain energy release rate for crack initiation, Jci, in each case. Fracture behaviour showed a significant dependence on the adherend thickness; the Jci and plastic deformation of the solder at crack initiation decreased significantly with increase in adherend thickness. This behaviour was attributed to changes in stress distribution along the solder layer when the adherend thickness was varied. The capability of Jci as a property was then assessed to predict the fracture load of solder joints in specimens with different constraint levels caused by variations in adherend thicknesses. In light of the results obtained, a cohesive zone model (CZM) was developed to predict the fracture load of solder joints as a function of adherend thickness. Finally, a CZM with a single set of parameters was established to predict the fracture loads for all the cases. It was concluded that CZM was a better methodology to account for changes in degree of joint constraint imposed by bonding adherends.

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