Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering

Abdullah, Muhammad Asyraf; Idris, Siti Rabiatull Aisha

doi:10.1007/978-981-19-1457-7_67

Cited by 1 publication

(4 citation statements)

References 25 publications

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“…During isothermal aging, diffusion rate still increased at the same time the inter-diffusion atoms remain fill the gully. As reported (Abdullah and Idris, 2023), IMC layer thickness has greatly risen because the gully of the IMC layer serves as a channel for atoms to diffuse towards each other. As reported by Han et al (2019), the shear strength exhibited a modest reduction as the ageing period rose due to the solid solution strengthening, the precipitation strengthening and the fine grain strengthening.…”

Section: Resultsmentioning

confidence: 75%

“…The study involved measuring the thickness of IMC layers and analysing various relationships between them. Based on our previous study (Abdullah and Idris, 2023), the results indicated that laser-soldered joints with shorter processing time had thinner IMC layers as compared to reflow-soldered joints. Moreover, the entire IMC layer thickness in laser soldering was found to be lower than that of reflow soldering, regardless of the heat treatment duration.…”

Section: Resultsmentioning

confidence: 84%

“…The spreading rate, wetting angle, spreading area and other parameters are the main indicators for the wettability of Pb-free solders (Tu and Zeng, 2001). As reported by Abdullah and Idris (2023), the contact angle of Sn-xCu solder alloy for 0.0, 0.3, 0.5, 0.7, 1.0 Wt.% Cu is 24.12°-34.77°. In this study, spreading area for all samples was given as 94.5% from the substrate's surface as shown in Figure 8.…”

Section: Spreading Area Single-lap Shear Strengthmentioning

confidence: 80%

“…For 1,000 h aging, IMC thickness was 3.86 and 3.70 µm for Sn–0.3Cu and Sn–1.0Cu, respectively, after laser soldering. Our previous study (Abdullah and Idris, 2023) revealed that the interface will be supersaturated with Ni and Cu from substrate and was blocked by the existing IMC layer. After prolonged aging time, IMC layer growth was controlled by grain boundary diffusion and growth at a slower rate (Leng et al , 2009).…”

Section: Resultsmentioning

confidence: 99%

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Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering

Abdullah

Idris

2023

SSMT

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Purpose Pb-free solders have been developed to replace the standard Sn–Pb eutectic solder since the prohibition on Pb used in solders. The Sn–Ag–Cu series of lead-free solders is the most extensively used in the electronics industry. The Ag3Sn, which forms during isothermal ageing, can significantly degrade solder joint reliability. Sn–Ag–Cu solder’s high price further hindered its use in the electronics industry. This paper aims to investigate different copper percentages into Sn–xCu solder alloy to improve its microstructure and strength performance. Design/methodology/approach The solder alloys used in this work were Sn–xCu, where x = 0.0, 0.3, 0.5, 0.7, 1.0 Wt.%, which was soldered onto electroless nickel immersion gold (ENIG) substrate using carbon dioxide (CO2) gas laser. Then these samples were subjected to isothermal aging for 0, 200, 500, 1,000 and 2,000 h. The Sn–xCu solder alloy was fabricated through a powder metallurgy process. Findings Microstructure characterization showed that Cu addition resulted in fine and rounded shape of Cu–Sn–Ni particles. Shear strength of Sn–xCu solder joints was increased with increasing Cu content, but at aging duration of 1,000 h, it dropped slightly. It is believed that the strength improved due to the increment of diffusion rate during isothermal aging. Practical implications In a Cu–Sn solder, the recommended amount is 1.0 Wt.% of Cu. In extensive aging procedures, it was discovered that Sn1.0Cu solder improved the reliability of solder joints. The findings indicated that the innovative solder alloys might satisfy the needs of high-reliability applications. Originality/value The study shows that the right amount of Cu enhances the solidification of Sn–Cu solder, increasing the shear force of the Cu–Sn solder joint. The Sn1.0Cu exhibits a ductile fracture on the top microstructure, improving the joint’s average shear strength.

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Section: Resultsmentioning

confidence: 75%

Section: Resultsmentioning

confidence: 84%