2020
DOI: 10.1016/j.diamond.2020.108111
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Effect of sintering temperature on grain growth and mechanical properties of copper/graphene nanosheet composite

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Cited by 12 publications
(2 citation statements)
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“…For this sintering temperature, the highest values of relative density above 90%, low porosity, and a higher Young's modulus in the range (92-96%) were achieved. Increasing the sintering temperature is beneficial because a higher temperature accelerates atomic diffusion and increases the migration rate of grain boundaries, which in turn promotes a reduction of pore size and an improvement in density [56,57]. This is consistent with the results of other works [33,58,59].…”
Section: Characterisation Of Sintered Cu-zrb2 Compositessupporting
confidence: 90%
“…For this sintering temperature, the highest values of relative density above 90%, low porosity, and a higher Young's modulus in the range (92-96%) were achieved. Increasing the sintering temperature is beneficial because a higher temperature accelerates atomic diffusion and increases the migration rate of grain boundaries, which in turn promotes a reduction of pore size and an improvement in density [56,57]. This is consistent with the results of other works [33,58,59].…”
Section: Characterisation Of Sintered Cu-zrb2 Compositessupporting
confidence: 90%
“…1,2 Graphene (Gr), along with Gr derivatives like Gr oxide (GO), reduced GO (rGO), Gr nanosheets (GNSs), and Gr nanoplates (GNPs) are relatively novel solutions for use as reinforcement agents in metal matrix composites (MMCs) like CuMCs and W-Cu MCs to enhance the microstructure homogeneity, together with an increase in mechanical, electrical, thermal, electrochemical, and functional properties. [26][27][28][29][30][31][32][33][34][35][36] Graphene is a carbon allotrope that comprises a monolayer of sp 2 -hybridized C atoms placed in a 2D hexagonal lattice with one atom thickness of around 0.35 nm. 37 Graphene is commonly synthesized by mechanical cleaving (exfoliation), chemical synthesis by reduction of graphite oxide, thermal CVD, and plasma enhanced CVD methods.…”
Section: Introductionmentioning
confidence: 99%