Effect of Shock Wave on Constant Load Behaviour of Pb-Free/Cnt Solder Joint

Ismail, Norliza; Jalar, Azman; Yusoff, Wan Yusmawati Wan; Safee, Nur Shafiqa; Ismail, Ariffin

doi:10.17576/jsm-2020-4912-15

Cited by 4 publications

(5 citation statements)

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“…Similarly, we discovered that the last pre-transfusional Hb level was an important associate of QoL. This was similar to the findings of an Indian study [ 13 ] and several foreign studies [ 15 , 20 , 21 ], which reported similar observations. It may be so because the optimal Hb level in the blood at any given point of time directly influences the physical and mental functioning and the overall QoL of a thalassemic child, just as it does for any other human being.…”

Section: Discussionsupporting

confidence: 91%

An Epidemiological Study of the Quality of Life of Children With Beta-Thalassemia Major (β-TM) and Its Correlates in Kolkata, West Bengal, India

Biswas¹,

Naskar²,

Basu³

et al. 2023

Cureus

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Background and objectivesIn contrast to their peers who are healthy, children with thalassemia disease are likely to have a lower quality of life (QoL). Knowledge of attributes affecting the QoL of thalassemic children may help identify key areas of intervention to improve it. Thus, the current study was envisioned to find out the quality of life (QoL) of children with beta-thalassemia major (β-TM) and its various correlates. MethodsBetween May 2016 and April 2017, an institution-based cross-sectional observational study was conducted in the thalassemia unit of Calcutta National Medical College and Hospital (CNMC&H), Kolkata, West Bengal, India. During the study period, 328 β-TM children and their carers were interviewed using a structured schedule. ResultsIn the final multivariable logistic regression model, thalassemic children who were residing in an urban area (adjusted odds ratio (AOR) (95% confidence interval (CI)): 2.1 (1.1-4.0)), had mothers with a higher educational level (middle and above) (AOR (95%CI): 2.1 (1.1-4.0)), had working parents (AOR (95%CI): 2.7 (1.2-6.3)), had no family history of thalassemia (AOR (95%CI): 3.5 (1.6-8.0)), received less number of blood transfusion in the previous year (<12) (AOR (95%CI): 2.1(1.1-4.2)), had higher pre-transfusional hemoglobin (Hb) level (AOR (95%CI): 1.7(1.1-2.6)), had no transfusion-transmitted infections (TTIs) (AOR (95%CI): 2.8 (1.5-5.2)), had higher body mass index (BMI) Z score (AOR (95%CI): 1.6 (1.1-2.2)), and had higher Carer Quality of Life (CarerQoL) score (>5) (AOR (95%CI): 3.2 (1.6-6.2)) were more likely to have favorable QoL (Pediatric Quality of Life Inventory (PedsQL) score > 54.3). Interpretation and conclusionsThe QoL of the study participants was significantly correlated with their carers' CarerQoL, mother's educational level, parent's working status, place of residence, family history of the disease, blood transfusion frequency, pre-transfusional Hb level, and nutritional and comorbidity status.

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Section: Discussionsupporting

confidence: 91%

An Epidemiological Study of the Quality of Life of Children With Beta-Thalassemia Major (β-TM) and Its Correlates in Kolkata, West Bengal, India

Biswas¹,

Naskar²,

Basu³

et al. 2023

Cureus

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“…Due to the excellent mechanical properties of CNTs, they can bear most of the stress. Ismail et al [29] explained this mechanism through experimental results, showing that adding CNTs prevents sudden changes in the deformation mechanism in solder under shock waves. Compared with the SAC305 solder joints of the explosion test samples and the control samples, the indentation depth displacements of the SAC305-CNTs solder joints of the explosion test samples and the control samples were reduced by about 42% and 56%, respectively.…”

Section: Strengthening Mechanism Of Cnt Composite Soldermentioning

confidence: 99%

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Li,

Qin,

Mai

et al. 2023

Crystals

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Carbon nanotubes (CNTs) are being applied with increasing frequency for advanced soldering. They have excellent mechanical, electrical, and thermal properties and are primarily used to reinforce lead-free solders. This paper discusses the strengthening mechanism of CNTs, introduces the preparation methods of CNT composite solders, and focuses on the review of tin-based lead-free solders reinforced with unmodified CNTs and metal-modified CNTs. The addition of CNTs can effectively improve the ultimate tensile strength, microhardness, shear strength, and creep resistance of the solder. However, the practical application of CNT composite solders has been a challenge for researchers for decades. The most significant issue is uniform dispersion due to the large density and surface differences between CNTs and solders. Other concerns are the structural integrity of CNTs and their limited addition amount, solder wettability, and interfacial bonding. CNT composite solders can only be widely used in a real sense when these challenges are properly addressed and overcome. At present, there is a lack of comprehensive reviews covering the structure, the strengthening mechanism, the preparation method of CNT composite solders, and the influence of CNT types on their strengthening effects. Therefore, this paper aims to fill this gap and contribute to solving the problems faced by the application of CNTs in solder. Future work is expected to focus on improving the dispersion and bonding of CNTs and optimizing the preparation method.

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“…In addition, electronic devices are used in extreme environments, such as automotive, power electronics and aerospace engines, where solder joints are exposed to very high temperatures, often above of 200°C. Many previous works have reported the effects of harsh environments on the mechanical properties of solder joints in electronic devices (Lall et al , 2020; Sun et al , 2008; Ismail et al , 2020b). However, there are few studies that address the effects of radiation on the mechanical properties of solder joints in electronic applications.…”

Section: Introductionmentioning

confidence: 99%

“…The effect of aging on the solder joint became more prominent as the aging time and temperature increased. Another study by Ismail et al (2020b) reported the constant load behaviour or creep properties of SAC305/CNT solder joints under shock wave conditions via the nanoindentation approach. As a result, exposure to shock waves degraded the creep properties of solder joints.…”

Section: Introductionmentioning

confidence: 99%

Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach

Yusoff

Ismail

Lehan

et al. 2022

SSMT

Self Cite

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Purpose This paper aims to investigate the effect of different doses of gamma radiation on the micromechanical response (hardness properties and creep behaviour) of 96.5Sn-3.0Ag-0.5Cu (SAC305) solder alloys. Design/methodology/approach SAC305 solder pastes deposited on printed circuit boards (PCBs) were subjected to a reflow soldering process to form soldered samples. The soldered samples were irradiated with a gamma source at different doses (5–50 Gy). Nanoindentation testing was used to determine the hardness properties and creep behaviour after gamma irradiation. Findings The results showed that the hardness of SAC305 solder alloys gradually increased up to 15 Gy and then gradually decreased to 50 Gy of gamma irradiation. The highest hardness value (0.37 GPa) was observed on SAC305 solder alloys exposed to 15 Gy irradiation. Hardening of SAC305 solder alloy was suggested to be due to the high defect density induced by the gamma irradiation. Meanwhile, exposure to 50 Gy irradiation resulted in the lowest hardness value, 0.13 GPa. The softening behaviour of SAC305 solder alloy was probably due to the evolution of defect size in the solder joint. In addition, the creep behaviour of the SAC305 solder alloys changed significantly with different gamma irradiation doses. The creep rates were higher at a dose of 10 Gy up to a dose of 50 Gy. Gamma irradiation caused the SAC305 solder alloy to become more ductile compared to the non-irradiated alloy. The stress exponent also showed different deformation mechanisms with varying gamma doses. Originality/value Research into the micromechanical properties of solder alloys subjected to gamma irradiation has rarely been reported, especially for Sn-Ag-Cu lead-free solder. Thus, this research provides a fundamental understanding of the micromechanical response (hardness and creep behaviour) of solder, especially lead-free solder alloy, to gamma irradiation.

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Effect of Shock Wave on Constant Load Behaviour of Pb-Free/Cnt Solder Joint

Cited by 4 publications

References 0 publications

An Epidemiological Study of the Quality of Life of Children With Beta-Thalassemia Major (β-TM) and Its Correlates in Kolkata, West Bengal, India

An Epidemiological Study of the Quality of Life of Children With Beta-Thalassemia Major (β-TM) and Its Correlates in Kolkata, West Bengal, India

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach

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