2009 59th Electronic Components and Technology Conference 2009
DOI: 10.1109/ectc.2009.5074195
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Effect of shapes of crack fronts on the mechanics of 3D interfacial delamination in IC packages

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Cited by 2 publications
(2 citation statements)
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“…That implies that the middle of the crack front will propagate first. Based on this, Ho and Tay [21] concluded that the convex shape would evolve into the concave one. However, since the mode mixity is relatively constant along the crack front, regardless of the initial shape, it follows that the convex shape would have to "go through" the straight form first, before changing to the concave one.…”
Section: Resultsmentioning
confidence: 98%
See 1 more Smart Citation
“…That implies that the middle of the crack front will propagate first. Based on this, Ho and Tay [21] concluded that the convex shape would evolve into the concave one. However, since the mode mixity is relatively constant along the crack front, regardless of the initial shape, it follows that the convex shape would have to "go through" the straight form first, before changing to the concave one.…”
Section: Resultsmentioning
confidence: 98%
“…The work of Ho and Tay (2009) delves into a profound exploration of the influence of initial delamination shapes on the mechanics of 3D interfacial delamination within the IC packages, considering the three distinct front shapes, concave, straight, and convex. Notably, their findings reveal intriguing insights into the maximum energy release rate (ERR) associated with each of these front shapes [21]. Their findings provided valuable insights into optimizing the design strategies and materials to mitigate delamination risks in electronic packaging and related applications.…”
Section: Introductionmentioning
confidence: 96%