Effect of SDBS on the oxidation reliability of screen-printed Cu circuits

Lee, Choong‐Jae; Kim, Jae‐Ha; Hwang, Byeong-Uk; Min, Kyung Deuk; Jung, Seung‐Boo

doi:10.1007/s10854-019-02847-z

Cited by 1 publication

(2 citation statements)

References 41 publications

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“…Lee et al found that the effects of sodium dodecylbenzene sulfonate (SDBS) prevented the oxidation of sintered Cu circuits under high-temperature storage (HTS) and a steady-state temperature humidity bias life test (HTHH) under 85 °C/85% relative humidity environmental conditions [ 48 ]. The Cu-based ink from PVP-protected Cu nanoparticles (about 40 nm in size) was formulated for screen printing and improving the adhesion with the substrate, including ethylcellulose and various contents of SDBS (0, 1, 2 and 3 wt% per paste), and α-terpineol as the paste solvent.…”

Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

“…The main bottleneck of PVP-protected Cu nanoparticle ink is the typical sintering temperature higher than 250 °C, since the thermal decomposition of PVP can occur above 250 °C and the hydrogen-driven reduction temperature should be higher than 230 °C to eliminate the surface oxide layers [ 45 , 46 , 47 , 48 ]. The high sintering temperature limits the use of flexible substrates, such as PET or PC, because of the low softening point (Tg) below 150 °C.…”

Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

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Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

View full text Add to dashboard Cite

show abstract

Effect of SDBS on the oxidation reliability of screen-printed Cu circuits

Cited by 1 publication

References 41 publications

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

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