Effect of Scribe Line Metal Layout on Wafer Saw Top Edge Chipping for Silicon Power Devices

Barbosa, Ronald; Pinili, Ton; Estremera, Leo; Brizar, Guy; Rolofson, Kirk; Barth, Will; McGlone, John; Hose, Sallie; Gambino, Jeff

doi:10.1109/eptc59621.2023.10457610

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023

DOI: 10.1109/eptc59621.2023.10457610

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Effect of Scribe Line Metal Layout on Wafer Saw Top Edge Chipping for Silicon Power Devices

Ronald Barbosa,

Ton Pinili,

Leo Estremera

et al.

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Effect of Scribe Line Metal Layout on Wafer Saw Top Edge Chipping for Silicon Power Devices

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References 15 publications

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