Effect of Relative Humidity on the Wettability of Steel Surfaces

Gledhill, R. A.; Kinloch, A. J.; Shaw, Stephen J.

doi:10.1080/00218467708075101

Cited by 30 publications

(17 citation statements)

References 6 publications

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“…Gledhill et al [10] studied the effects of a range of relative humidities on the wettability of mild steel surfaces of different rugosities. Contact angles for water and seven organic liquids were determined and as the relative humidity increased the contact angle increased.…”

Section: Literaturementioning

confidence: 99%

The influence of environment on the drop size ? contact angle relationship

Ponter

Yekta-Fard

1985

Colloid & Polymer Sci

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Advancing contact angles are reported for the water-PTFE, water-copper, water-stainless steel, water-PMMA and n-decane-PTFE systems for a range of liquid drop sizes.The angles were determined at 25 ~ in an air or nitrogen-saturated atmosphere and compared with those measured at the boiling point in an environment only of its vapor.For water-PTFE and water-PMMA systems, a decrease in contact angle with decreasing drop size was observed in an air-saturated environment at 25 ~ confirming the data of Good and Koo. An increase in contact angle however occurred with decreasing drop size at the boiling point in the pure vapor atmosphere confirming the results of Boyes and Ponter. The introduction of nitrogen decreased the contact angle although the trend remained the same.

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Section: Literaturementioning

confidence: 99%

The influence of environment on the drop size ? contact angle relationship

Ponter

Yekta-Fard

1985

Colloid & Polymer Sci

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“…The adhesion Strength of the interfacial zone has been known to depend on the thermodynamical work of adhesion, which is closely related to the surface free energy of the fiber and the matrix [1][2][3][4][5][6][7][8][9][10]. A stable adhesion is required at the interface between the reinforcing' agent and the matrix in order to obtain mechanical performances of the composite materials.…”

Section: Introductinmentioning

confidence: 99%

Determination of the surface free energy of modified carbon fibers and its relation to the work of adhesion

Tsutsumi

Ishida

Shibata

1990

Colloid & Polymer Sci

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Surface free energy of various carbon fibers was determined by tensiometric method in three different procedures. The dispersive ys a and the nondispersive y~ components were separately determined by contact angle measurements in two-phase system, formamide-n-alkanes. The yw increased by oxidation and decreased by hydrogen reduction, while the ys a remained almost constant. The y~ value determined from contact angle of water/ethyleneglycol solution tended to become higher. The critical surface flee energy was in harmony with the total free energy determined from formamide-n-alkanes system as long as liquids were properly selected. The formation of oxygen-containing functional groups was evidenced by ESCA, and the surface [O]/[C] ratio was related linearly to the surface polarity defined by yw a + y~]. Oxidation in liquid phase resulted in the formation of both hydroxyls and carboxyls, while only hydroxyls were formed in gas phase. The interracial shear strength of the fiber-epoxy resin could be closely correlated with thermodynamical work of adhesion calculated on the basis of surface free energy and its component.

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“…In the presence of liquid, however, the thermodynamic work of adhesion, W al , may well have a negative value indicating that the interface is unstable and will dissociate. Indeed, the thermodynamic work of adhesion at metal oxide/epoxy interfaces changes from positive to negative in the presence of water [85,103]. Evidently a significant amount of primary bonds thus must have existed at the copper/epoxy interface studied in [98] because the epoxy did not delaminate during exposure to the atmosphere at elevated humidity and temperature.…”

Section: Work Of Adhesionmentioning

confidence: 99%

Interfacial Adhesion in Polymer Systems

Laurila

Vuorinen

Mattila

et al. 2012

Interfacial Compatibility in Microelectronics

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Delamination is the manifestation of poor interfacial adhesion between dissimilar materials. Electronics components are manufactured using various dissimilar materials and these components are assembled into functional devices using again various dissimilar materials. Inherently many of the employed materials repel each other's proposing adhesion problems. Second, dissimilar materials respond differently to environmental stress factors like temperature and humidity changes, mechanical shocks etc. The above-mentioned facts result in a situation that demands in-depth understanding of interfacial adhesion when reliably performing electronics, microelectronics and bioMEMSs are designed.There is no doubt that molecules or atoms of solid materials stick together. Also the mechanisms by which this attraction between materials takes place have been described thoroughly in the literature. Nevertheless, there is a fundamental difference between adhesion as a molecular level phenomenon (adsorption, electrical attraction) and measured adhesion as an engineering level experience. At the engineering level, other adhesion mechanisms (being mechanical interlocking and diffusion) contribute significantly to the practical endurance and/or strength of the interface. These mechanisms often contribute simultaneously and result in some measurable adhesion that can be explained to a certain extent mathematically for simple interfaces utilising concepts like the thermodynamic work of adhesion and continuum fracture mechanics as will be shown later. In practice, the situation is far more complicated and it will be hard, if not impossible, to find a relation that would also consider starting with the following things: mechanical aspects (properties of the joint materials, geometry of the interface and roughness of the interface), defects at the interface (air bubbles, reaction products, degradation products, weak boundary layers, etc.), and penetration of foreign molecules into the interface (water through the interface or bulk material). The following two (apparently) simple questions are not easy to answer: first, will any two given materials stick together?; and, second, if they do stick together, how strong will they remain stuck together over the lifetime of the product?Interfacial adhesion may be described as the force needed to separate two bodies along their interface, and it is restricted therefore to the interfacial forces T. Laurila et al., Interfacial Compatibility in Microelectronics, Microsystems,

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Effect of Relative Humidity on the Wettability of Steel Surfaces

Cited by 30 publications

References 6 publications

The influence of environment on the drop size ? contact angle relationship

The influence of environment on the drop size ? contact angle relationship

Determination of the surface free energy of modified carbon fibers and its relation to the work of adhesion

Interfacial Adhesion in Polymer Systems

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