Effect of reactive and non-reactive diluents on thermal and mechanical properties of epoxy resin

T800/high-temperature epoxy resin composites with different hole shapes were subjected to hygrothermal ageing and thermal-oxidative ageing, and the effects of these different ageing methods on the open-hole properties of the composites were investigated, including analyses of the mass changes, surface topography changes (before and after ageing), fracture morphologies, open-hole compressive performance, dynamic mechanical properties and infrared spectrum. The results showed that only physical ageing occurred under hygrothermal ageing (70°C and 85% relative humidity), and the equilibrium moisture absorption rate was only approximately 0.72%. In contrast, under thermal-oxidative ageing at 190°C, both physical ageing and chemical ageing occurred. After ageing, the open-hole compressive strength of the composite laminates with different hole shapes decreased significantly, but the open-hole compressive strength after thermal-oxidative ageing was greater than that after hygrothermal ageing. Among the aged and unaged laminates, the laminates with round holes exhibited the largest open-hole compressive strength, followed by those with the elliptical holes, square holes and diamond holes. The failure modes of the laminates were all through-hole failures. The unaged samples had a glass transition temperature ( T g) of 226°C, whereas the T g of the samples after hygrothermal ageing was 208°C, which is 18°C less than that of the unaged samples, and the T g of the samples after thermal-oxidative ageing was 253°C, which is 27°C greater than that of the unaged samples.

Section: Resultsmentioning

confidence: 97%

Effects of hygrothermal and thermal-oxidative ageing on the open-hole properties of T800/high-temperature epoxy resin composites with different hole shapes

et al. 2019

“…But in case of CF/Ep composites, due to poor cross-linking density, the presence of unreactive diluents in the reaction sites resulted in reduction of peak intensities and absence of any filler material. 64…”

Section: Resultsmentioning

confidence: 99%

Studies on mechanical, thermal and tribological properties of carbon fibre-reinforced boron nitride-filled epoxy composites

Muralidhara

Babu

2020

This research focuses on the static mechanical, thermal and tribological properties of carbon fibre epoxy (CF/Ep) composites filled with boron nitride (BN) micro-filler powder (BN-CF/Ep). The mechanical properties studied were tensile, flexural, interlaminar shear strength and hardness. The thermal properties studied were dynamic mechanical and thermogravimetric analyses which were analysed through dynamic mechanical analyser and thermogravimetric analyser, respectively. The curing ability and dispersion of BN filler in the Ep and composites were investigated through differential scanning calorimetry, Fourier-transform infrared spectra and scanning electron microscopy. The tribological properties focused were three-body abrasion and dry sliding friction and wear conduct. Three-body abrasion tests were studied with silica sand of 212 µm particle size, 30 N load, 2.38 m s−1 sliding velocity and variable abrasive distances of 250 m, 500 m, 750 m and 1000 m. The dry sliding wear tests were performed using pin-on-disc (POD) wear experimental set-up with 60 N load, 3 m s−1 sliding velocity and variable sliding distances of 1000 m, 2000 m and 3000 m. The results followed the trend of BN1% > BN3% > BN5% composites in all mechanical properties. The carbon fabric reinforcement along with the BN-Ep matrix improved enormously all the mechanical properties except impact resistance. Further, it was exhibited that 1 wt% BN into CF/Ep prompts better mechanical properties with predominant damping capacity and thermal stability. Both the dry sand abrasive wear and POD test outcomes revealed that all BN-CF/Ep composites prompt predominant wear resistance. CF along with BN improves enormously the wear resistance with friction coefficient. Further, it was exhibited that 1 wt% BN into CF/Ep in both three-body abrasive and POD tests prompts better wear resistance. Generally speaking, it was presumed that BN-CF/Ep gracefully and successfully improved the mechanical, thermal and tribological properties and morphology of Ep for various mechanical, electrical components and load-bearing applications used in automotive and engineered applications.

“…Epoxy resin, as one of the most important thermosetting material, has been widely used in electronic industry due to its outstanding adhesion, lower density, high strength, good durability and excellent chemical resistance. 1 –11 However, the requirements for ideal electronic materials include good thermal stability, excellent hydrophobic, uncomplicated usability and low dielectric properties. 12 –18 Unfortunately, the properties of conventional epoxy resins (diglycidyl ether of bisphenol A (DGEBA)) could not satisfy the demand for advanced electronic materials.…”

Section: Introductionmentioning

confidence: 99%

Preparation and properties of a novel fluorinated epoxy resin/DGEBA blend for application in electronic materials

Shang

Jiang

2020

A novel epoxy monomer 4-trifluoromethyl phenylhydroquinone epoxy resin (4-TFMEP) was synthesized via a multistep procedure including the Meerwein arylation reaction and followed by nucleophilic reaction. The chemical structure of 4-TFMEP was confirmed by proton nuclear magnetic resonance and Fourier-transform infrared spectrum. Then a mixed system (DGEBA/4-TFMEP x%) composed of diglycidyl ether of bisphenol A (DGEBA) and 4-TFMEP was prepared by a melting method without any solvent. After curing, the properties of this series of mixed epoxy resins were measured and compared with the neat DGEBA. As a result, the blend resins exhibited good thermal stability, excellent hydrophobic and low dielectric properties with 4-TFMEP content increasing. Furthermore, the material of DGEBA/4-TFMEP 40% achieves higher glass transition temperature of 104°C and char yield 33% than DGEBA (char yield = 22%) possessed. In the contact angle testing, DGEBA/4-TFMEP 40% shows 127.2° satisfied the standard of hydrophobic material. In addition, by the test of dielectric properties, DGEBA/4-TFMEP x% materials show lower than DGEBA/boron trifluoride ethylamine (BF3MEA) material, because of the introduced side group of fluorine content into the material improves the electronegativity of epoxy material and reduced the polarizability of molecules efficient. Herein, we believe the novel mixed epoxy system (DGEBA/4-TFMEP x%) has a potential application in electronic industries.