Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder

Xia, Zhidong; Chen, Zhigang; Shi, Yaowu; Mu, N.; Sun, Ning

doi:10.1007/s11664-002-0126-3

Cited by 89 publications

(44 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…All microstructures consisted of Sn-dendrites and a eutectic mixture of Ag 3 Sn and Cu 6 Sn 5 intermetallics distributed in the Sn-rich matrix. The resulting RE-containing phases (dark phases in the micrographs) consisted of homogeneously distributed LaSn 3 , CeSn 3 and YSn 3 particles, respectively (Fig. 2).…”

Section: As-processed Microstructural Characterizationmentioning

confidence: 99%

“…[1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17] Several authors have shown that the addition of small amounts of RE elements can decrease alloy melting temperature, 2,8,14 improve wettability, 2,5,9,16 and even promote strong bonding to semiconductors such as silicon. 1,13 Rare earths have also been shown to refine the solder microstructure by decreasing the Sn grain size, 2,9,10,17 and intermetallic particle size, 2,9,15,17 and decrease the Cu 6 Sn 5 layer that forms between the Cu substrate and the Pb-free solder.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

Dudek

Chawla

2008

Journal of Elec Materi

View full text Add to dashboard Cite

We have previously shown that small additions of the rare-earth (RE) element La to Sn-Ag-Cu alloys significantly increases their ductility, without significant loss in the overall strength. However, due to the high reactivity of La with oxygen, oxidation of the La-containing phases can affect the mechanical performance of the solder. In this work, we have investigated the effect of the addition of 2 wt.% Ce, La and Y on the oxidation behavior of Sn-3.9Ag-0.7Cu. Oxidation kinetics were established by heating samples in ambient air to 60°C, 95°C or 130°C for up to 250 h. Microstructural characterization of the samples, before and after oxidation, was conducted in order to determine the influence of RE-containing phases on the oxidation kinetics. The oxidation mechanism, including the phenomenon of Sn whiskering during oxidation, is also discussed.

show abstract

Section: As-processed Microstructural Characterizationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

Dudek

Chawla

2008

Journal of Elec Materi

View full text Add to dashboard Cite

show abstract

“…The addition of a small amount of La (up to 0.5 wt%) to SAC refined the microstructure by decreasing the length and spacing of Sn dendrites and decreased the interfacial Cu-Sn IMC thickness [82], which significantly enhanced its elongation with a small decrease in shear strength. In addition, some refinement of Sn grain size and IMC particles was also reported [83,84]. However, in the case of Ce-added SAC, abnormal Sn whisker growth was reported even after 1 day at an extremely high growth rate ($8.6 A /s) [85].…”

Section: Modifying the Microstructure Of Sacmentioning

confidence: 96%

“…The additions of rare-earth metals, such as Ce, La, or Y, have been reported to improve wettability, creep strength and tensile strength, and to refine the microstructure of Pb-free solder joints [81][82][83][84][85]. The addition of a small amount of La (up to 0.5 wt%) to SAC refined the microstructure by decreasing the length and spacing of Sn dendrites and decreased the interfacial Cu-Sn IMC thickness [82], which significantly enhanced its elongation with a small decrease in shear strength.…”

Section: Modifying the Microstructure Of Sacmentioning

confidence: 99%

‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb‐Free Solders and Joints’

Kang¹

2012

Lead‐Free Solders: Materials Reliability for Electronics

View full text Add to dashboard Cite

Since July, 2006, following the EUs RoHS legislation, the consumer electronics industry has been offering 'green' products by eliminating Pb-containing solders and other toxic materials. This transition has been relatively smooth, because the reliability requirements are less stringent. However, the Pb-free transition for high-performance electronic systems (such as servers and telecommunication) is still on-going due to their rigorous reliability requirements. For example, the research and development efforts to implement Pb-free flipchip interconnections for high-end applications are still very active.In this chapter, the recent progress in Pb-free solder development, especially minor alloy additions to Sn-rich solders is reviewed in light of improving various physical, mechanical, metallurgical or electrical properties of solder joints. The topics to be discussed include those such as control of undercooling, microstructure, interfacial reactions, or void formation, as well as enhancing impact resistance, electromigration, and other mechanical properties.

show abstract

“…The alloy systems or intermetallic compounds composed of transition or rare earth metals have attracted much attention for the theoretical study of the solid state and for many industrial purposes, particularly in the fields of magnetism, energy and high technology [1].…”

Section: Introductionmentioning

confidence: 99%

First-Principles Calculations and Thermodynamic Assessment of the Li-Rh and Tl-Tm Systems

Djaballah¹,

Amer²,

Uğur³

et al. 2015

IJMMM

View full text Add to dashboard Cite

Abstract-Thermodynamic modeling of the Li-Rh and Tl-Tm systems was carried out via a hybrid approach of CALPHAD (CALculation of PHAse Diagrams) and first-principles calculations. The enthalpies of formation of LiRh, LiRh 3 , Tl 3 Tm, TlTm and Tl 3 Tm 5 are computed via first-principles calculations by using the VASP code. The CALPHAD assessment of Li-Rh and Tl-Tm systems was then performed by considering both the first-principles computed enthalpies of formation and the experimental phase equilibrium data. The liquid phase was modeled with Redlich-Kister polynomial and the five intermetallics compounds were described as stoichiometric compounds. A consistent thermodynamic data set and phase diagrams for the Li-Rh and Tl-Tm systems are obtained.

show abstract

Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder

Cited by 89 publications

References 4 publications

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb‐Free Solders and Joints’

First-Principles Calculations and Thermodynamic Assessment of the Li-Rh and Tl-Tm Systems

Contact Info

Product

Resources

About