2011
DOI: 10.4028/www.scientific.net/amr.418-420.936
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Effect of Process Parameters on Deposition Rate of Electroless Ni-P Plating on AZ91D Magnesium Alloy

Abstract: The effects of the concentrations of NiSO4•6H2O, NaH2PO2•H2O and complexing agents in bath, temperature, pH, SiC concentration etc. on deposition rate of electroless Ni-P plating were systematically studied. The appropriate deposition rate of electroless Ni-P plating (17μm h-1) was obtained at the optimal conditions. The deposition reaction dynamics of electroless Ni-P plating on AZ91D magnesium alloy was discussed and the corresponding kinetic model was also determined based on the corresponding experimental … Show more

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“…Following that, the adhesion between the coating and the substrate was measured by scratch method and the relationship between substrate surface roughness, modified fiber, and the adhesion was explored [23]. In addition, in order to ensure the efficiency of electroless deposition, the deposition rate of Ni-P alloy was also investigated [24][25][26]. Experimental research was conducted to investigate the effects of bath composition, pH level, and temperature on the deposition rate of Ni-P alloy.…”
Section: Introductionmentioning
confidence: 99%
“…Following that, the adhesion between the coating and the substrate was measured by scratch method and the relationship between substrate surface roughness, modified fiber, and the adhesion was explored [23]. In addition, in order to ensure the efficiency of electroless deposition, the deposition rate of Ni-P alloy was also investigated [24][25][26]. Experimental research was conducted to investigate the effects of bath composition, pH level, and temperature on the deposition rate of Ni-P alloy.…”
Section: Introductionmentioning
confidence: 99%