Effect of Process Condition on Tensile Properties of Carbon Fiber

Abstract

For polyacrylonitrile (PAN) based carbon fiber (CF) process, we developed a lab scale wet spinning line and a continuous tailor-made stabilization system with ten columns for controlling temperature profile. PAN precursor was spun with a different spinning rate. PAN spun fibers were stabilized with a total duration of 45 to 110 min at a given temperature profile. Furthermore, a stabilization temperature profile was varied with the last column temperature from 230 to 275 o C. Stabilized fibers were carbonized in nitrogen atmosphere at 1200 o C in a furnace. Morphologies of spun and CFs were observed using optical and scanning electron microscopy, respectively. Tensile properties of resulting CFs were measured. The results revealed that process conditions such as spinning rate, stabilization time, and temperature profile affect microstructure and tensile properties of CFs significantly.

Structural Evolution of Polyacrylonitrile Fibers in Stabilization and Carbonization

“…Molecular weight was found to be ~100,000 g/mol by HLC8320GPC (TOSOH, Japan). A lab scale spinning line was developed [7]. A spinneret with one hundred fifty holes was mounted for wet spinning at 20˚C.…”

Two step microwave plasma carbonization including low plasma power pre-carbonization for polyacrylonitrile based carbon fiber

“…The precursor was thermally stabilized for 140 min in a laboratory-made system for continuous CF stabilization [16,17]. The precursor passed through ten heating zones with temperatures ranging from 200 C to 295 C in the stabilization process.…”

Carbon Fibers and Their Composites

“…8.21. The spectra distinctly show the carbon, [123] oxygen, and nickel peaks of the samples. The peak intensity of the O 1s (BE = 532.8 eV) and the Ni 2p (BE = 857.6 eV) peaks of the Ni-plated carbon fibers was higher than that of the as-received carbon fibers.…”

“…Among these techniques, electroless Ni plating is a viable method to produce low resistive fillers for EMI shielding. Electroless Ni plating offers advantages of good metal deposition, very low electric resistivity and shielding effectiveness, and applicability to nonconducting materials with complicated shapes [122,123]. The nickel plating process is based on a redox reaction in which the reducing agent is oxidized and Ni 2+ ions are reduced on the substrate surface.…”