IEEE Microw. Wireless Compon. Lett.
 2008
DOI: 10.1109/lmwc.2008.922119
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Effect of Printed Circuit Board Structures on Temperature-Dependent Gain Characteristics of RF Power Amplifier Chips

J.K. Heo
1
,
Jae Choon Kim
2
,
Ki Hyuk Kim
3
et al.
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