Effect of Power on the Hollow Phenomenon during Laser Sintering of Copper Nanoparticles

Luo, Shaogen; Yang, Guannan; Xu, Guangdong; Cui, Chengqiang; Zhang, Yu

doi:10.1109/icept50128.2020.9202499

Cited by 1 publication

(1 citation statement)

References 10 publications

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“…Processes-based multistep simulation methods based on element birth and death technology are widely adopted to make simulation results more reliable and accurate [6]. This technique was used to evaluate warpage behavior of doublesided rigid-flex board assemblies during reflow soldering process [7] and to simulate the dynamically changing thermal properties of copper during the sintering process [8]. Element birth and death technique was also explored in 3-D modeling of through-silicon-via (TSV) with sidewall scallops in finite-element analysis (FEA) to evaluate and improve the thermo-mechanical reliability.…”

Section: Introductionmentioning

confidence: 99%

Using Element Birth and Death Technique in Modeling Cumulative Molded Substrate Expansion before Singulation

Talledo¹

2021

JERR

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Semiconductor packages are commonly assembled and molded in array format on a substrate strip before they are singulated into individual units. However, cumulative substrate expansion causes problems such as machine vacuum error or misaligned cut during singulation if the substrate expansion is not factored in. This study uses element birth and death technique in modeling the overall expansion of the molded substrate strip so that the predicted expansion could be considered in the singulation tooling design offsets. The expansion of the substrate was modeled with the different package assembly processes and thermal conditions. Modeling results showed that there is a cumulative increase in the length of the substrate as it passes through the different processes. The results are in agreement with actual substrate expansion prior to package singulation. This would not be captured when simulation is done only for the molded substrate without considering the cumulative contribution of the preceding processes. With the element birth and death technique in process-based thermomechanical modeling, substrate expansion could already be forecasted, and package assembly problems avoided.

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Section: Introductionmentioning

confidence: 99%

Using Element Birth and Death Technique in Modeling Cumulative Molded Substrate Expansion before Singulation

Talledo¹

2021

JERR

View full text Add to dashboard Cite

show abstract

Effect of Power on the Hollow Phenomenon during Laser Sintering of Copper Nanoparticles

Cited by 1 publication

References 10 publications

Using Element Birth and Death Technique in Modeling Cumulative Molded Substrate Expansion before Singulation

Using Element Birth and Death Technique in Modeling Cumulative Molded Substrate Expansion before Singulation

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