Effect of porosity on deuterium retention in titanium thin film

Abstract

The absorption process of deuterium in titanium was studied in titanium film produced in two different types of copper substrate, one was a polished copper substrate and the other one was chemically etched copper substrate. Titanium film was produced by thermal evaporation method. It was activated at a temperature of 500 0C followed by deuteration at room temperature. Titanium film was characterized by XRD for crystallographic information, SEM for surface morphology, RGA for deuterium desorption studies and weight measurement for D/Ti ratio. The difference in porosity of both the samples is confirmed from XRD analysis and SEM images. Different diffusion process is observed in two different substrates from the RGA spectra. Presence of multiple trap sites in the thin film of both the substrates is observed from the RGA spectra. From the weight measurement, D/Ti ratio in polished substrate is found to be 1.03 whereas in case of chemically etched substrate it is 1.54.