Effect of Polymer Substrate on Adhesion of Electroless Plating in Irradiation-Based Direct Immobilization of Pd Nanoparticles Catalyst

Abstract

Pd nanoparticles were directly immobilized on acrylonitrile–butadiene–styrene copolymer (ABS), acrylonitrile–styrene copolymer (AS), polystyrene (PS), polyphenylene sulfide (PPS), poly(vinyl chloride) (PVC), polypropylene (PP), and polyethylene (PE) polymer substrates via chemical reactions induced by ionizing irradiation. X-ray photoelectron spectroscopy analysis revealed that the chemical state of the immobilized Pd nanoparticles depended on the polymer substrate type. Electroless plating was performed using the immobilized Pd nanoparticles as the catalyst, and Cu-plating films were deposited on all polymer substrates. The results of the tape-peeling test suggested that the chemical state of the immobilized Pd nanoparticles on the polymer substrates affected the plating adhesion strength. Notably, ABS with immobilized Pd particles exhibited a high adhesion strength beyond the practical level, even without prior chemical etching. It was presumed that the high adhesion strength was owing to the anchoring effect of the holes generated on the ABS surface by ionizing irradiation.

A comprehensive review on surface modifications of polymer‐based 3D‐printed structures: Metal coating prospects and challenges

“…This technology offered a faster and customizable manufacturing process for functional electronic products. Palladium (Pd) nanoparticles were successfully immobilized on diverse polymer substrates through chemical reactions induced by ionizing irradiation 119 . The Pd nanoparticle's chemical state exhibited variability based on the polymer employed.…”

“…This technology offered a faster and customizable manufacturing process for functional electronic products. Palladium (Pd) nanoparticles were successfully immobilized on diverse polymer substrates through chemical reactions induced by ionizing irradiation 119. The Pd nanoparticle's chemical state exhibited variability based on the polymer employed.Subsequently, electroless copper (Cu) plating was carried out on these substrates, with immobilized Pd serving as the catalyst, resulting in different adhesion strengths for the plated films based on the substrate type.…”

Recent Progress in the Application of Palladium Nanoparticles: A Review

“…On the other hand, Pd NPs tend to agglomerate, leading to a decrease in the surface area. To overcome this problem, Pd NPs should be immobilized on the surface of a solid support such as metal oxide [33], silica [34], polystyrene [35], activated carbon [36], or carbon nanotubes [37]. A solid support helps to increase the activity of the catalyst by preventing the aggregation of Pd NPs, enhancing the stability and simplifying the recovery of the catalyst after the reaction, thus decreasing the cost and the chemicals used [38].…”