1972
DOI: 10.1007/bf00649818
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Effect of oxygen on the scale resistance of titanium-tin alloys

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Cited by 8 publications
(4 citation statements)
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“…[23] These behaviors are thought to occur because of vacancies created by the diffusion of Sn to the interface; these vacancies facilitate the diffusion of Ti, thereby enhancing the formation of TiO 2 .…”
Section: Resultsmentioning
confidence: 99%
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“…[23] These behaviors are thought to occur because of vacancies created by the diffusion of Sn to the interface; these vacancies facilitate the diffusion of Ti, thereby enhancing the formation of TiO 2 .…”
Section: Resultsmentioning
confidence: 99%
“…Sn segregated in the substrate near the TiO 2 /substrate interface, as shown in Figures 7(a) and (b); this segregation can deteriorate the adherence of oxides at the interface, as reported for Sn-added a-Ti and a-b alloys. [22,23] For all the alloys oxidized at 973 K (700°C), TiO 2 formed internally and Al was enriched at the external Al 2 O 3 layer. Several Al peaks were observed in the TiO 2 regions of the concentration profiles of Sn-added TKT8 and TKT9 in Figure 7, indicating the formation of alternating layers of Al 2 O 3 and TiO 2 .…”
Section: Resultsmentioning
confidence: 99%
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“…Hence, a small amount of Al decreases the oxidation resistance of TA29 alloy. As for the segregation of Sn at the oxide-substrate interface, on the one hand, it increases the vacancy concentration in the alloy, promoting the diffusion of Ti atoms in the alloy; on the other hand, it reduces the adhesion between the oxide scale and the substrate, prompting the oxide scale to peel off [38,39,40]. Both intensify the reaction between Ti and O and decrease the oxidation resistance of the alloy, thus Sn is detrimental to the oxidation resistance of TA29 alloy.…”
Section: Discussionmentioning
confidence: 99%