2021
DOI: 10.1116/6.0001207
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Effect of O2 plasma exposure time during atomic layer deposition of amorphous gallium oxide

Abstract: Amorphous gallium oxide thin films were grown by plasma-enhanced atomic layer deposition on (100) silicon substrates from trimethylgallium Ga(CH3)3 precursor and oxygen plasma. At 200 °C, the growth per cycle is in the range of 0.65–0.70 Å for O2 plasma exposure times ranging from 3 up to 30 s during each cycle. The effect of O2 plasma exposure times on the interfacial SiOx regrowth and the electrical properties was investigated. In situ spectroscopic ellipsometry shows that the SiOx regrowth occurs during the… Show more

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Cited by 8 publications
(6 citation statements)
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“…62 For the as-deposited Ga 2 O 3 films, the C 1s peak at 285–286 eV was attributed to hydrocarbon species with C–H or C–C bonds, while the peak at ∼290 eV was attributed to oxidized carbonaceous species with C–O–C or O–CO bonds, both of which disappeared after sputtering for 15 min. 99…”
Section: Properties Of Filmsmentioning
confidence: 99%
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“…62 For the as-deposited Ga 2 O 3 films, the C 1s peak at 285–286 eV was attributed to hydrocarbon species with C–H or C–C bonds, while the peak at ∼290 eV was attributed to oxidized carbonaceous species with C–O–C or O–CO bonds, both of which disappeared after sputtering for 15 min. 99…”
Section: Properties Of Filmsmentioning
confidence: 99%
“…The growth rate increased initially with increasing TEG dose, but then remained at 0.062 nm per cycle when the TEG pulse time was longer than 0.1 s. 71 Kro ¨ncke et al found that 3 s was the lower limit for O 2 plasma pulse, and the growth rate was greatly reduced at a shorter time and limited by the low flux of the oxygen species. 99 Ding's group found that 0.1 s TMG was enough to reach saturation, and the growth rate was almost independent on the pulse duration of 0.1 to 0.2 s. The growth rate increased with O 2 plasma duration and was saturated at the pulse time of 18 s. 63 Donmez et al reported that 0.015 s duration was enough for TMG dose and 10 s for O 2 duration; five seconds of Ar flow was sufficient for complete the purging of excess precursors and gaseous byproducts. 61 As shown in Fig.…”
Section: Pulse Processmentioning
confidence: 99%
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“…The atomic-scale thickness and low-cost fabrication of 2D GaO X , combined with the desirable dielectric properties of conventional GaO X films, such as an ultrawide bandgap greater than 5 eV , and a sizable static dielectric constant of 10–14, , make 2D GaO X a promising candidate for use as a high-quality insulator for MISFET architectures. In this study, a large-area 2D GaO X dielectric with a controllable nanometer-scale thickness via stacking was fabricated using the liquid-gallium squeezing technique and combined with an exfoliated β-Ga 2 O 3 FET to form a novel 2D GaO X /β-Ga 2 O 3 MISFET.…”
Section: Introductionmentioning
confidence: 99%
“…Possibilities to improve high-performance power-electronic devices used in trains, charging infrastructure of electrical cars, grid-scale energy storage, motor controls, and different military systems are constantly studied. Owing to its wide bandgap and large breakdown field, gallium oxide (Ga 2 O 3 ) could be a promising material for these applications. Moreover, Ga 2 O 3 is a prospective material for gas sensors, , solar-blind UV detectors, X-ray detectors, and solar cells. , …”
Section: Introductionmentioning
confidence: 99%