Effect of Ni-modified reduced graphene oxide on the mechanical properties of Sn–58Bi solder joints

Qin, Wei; Yang, Wenchao; Zhang, Lei; Qi, Da; Song, Qianqian; Zhan, Yongzhong

doi:10.1016/j.vacuum.2023.111943

Cited by 7 publications

(2 citation statements)

References 49 publications

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“…The addition of Ni can significantly suppress the coarsening phenomenon of the microstructure and achieve the goal of improving the mechanical properties of solders [6,[17][18][19][20]. Kanlayasiri et al [21] studied the effect of Ni on the physical properties of Sn58Bi solder and the interfacial reaction between the solder with copper substrate.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

Kong,

Zhai,

et al. 2024

Crystals

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Sn58Bi solder is considered a promising lead-free solder that meets the performance requirements, with the advantages of good wettability and low cost. However, the low melting point characteristic of Sn58Bi poses a serious threat to the high-temperature reliability of electronic products. In this study, Sn58Bi solder alloy based on nickel (Ni) functionalization was successfully synthesized, and the effect of a small amount of Ni on creep properties and hardness of Cu/Sn58Bi/Cu micro solder joints at different temperatures (25 °C, 50 °C, 75 °C, 100 °C) was investigated using a nanoindentation method. The results indicate that the nanoindentation depth of micro solder joints exhibits a non-monotonic trend with increasing Ni content at different temperatures, and the slope of the indentation stage curve decreases at 100 °C, showing that the micro solder joints undergo high levels of softening. According to the observation of indentation morphology, Ni doping can reduce the indentation area and accumulation around the indentation, especially at 75 °C and 100 °C. In addition, due to the severe creep phenomenon at 100 °C, the indentation hardness rapidly decreases. The indentation hardness values of micro solder joints of Cu/Sn58Bi/Cu, Cu/Sn58Bi-0.1Ni/Cu, and Cu/Sn58Bi-0.2Ni/Cu at 100 °C are 14.67 ± 2.00 MPa, 21.05 ± 2.00 MPa, and 20.13 ± 2.10 MPa, respectively. Nevertheless, under the same temperature test conditions, the addition of Ni elements can improve the high-temperature creep resistance and hardness of Cu/Sn58Bi/Cu micro solder joints.

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Section: Introductionmentioning

confidence: 99%

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

Kong,

Zhai,

et al. 2024

Crystals

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“…Various types of nanoparticles are used to modify lead-free solders, including metals particles (such as Al, Co, Ni, Mo, etc.) [13][14][15] and nonmetals (such as ZrO 2 , carbon nanotubes, graphene, SiC) [16][17][18][19]. Graphene is a two-dimensional carbon material with outstanding electrical and thermal conductivity and a high surface area.…”

Section: Introductionmentioning

confidence: 99%

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Yu²,

et al. 2023

Metals

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In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified graphene composite solders are classified according to the different solder systems. Metal-particle-modified graphene composite solders are classified according to different metal particles. However, there are still challenges with graphene composite solders. The main challenge is the poor bonding of graphene to the substrate and the nonuniform dispersion. Future directions for the development of graphene composite solders are proposed. They can provide some reference for the development of new graphene composite solders in the future.

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Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging

Du,

Ji,

Lin

et al. 2024

Engineering Fracture Mechanics

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Effect of Ni-modified reduced graphene oxide on the mechanical properties of Sn–58Bi solder joints

Cited by 7 publications

References 49 publications

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging

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