Effect of nanosized graphite on properties of Sn–Bi solder

Yang, Li; Du, Chengchao; Dai, Jun; Zhang, Ning; Jing, Yanfeng

doi:10.1007/s10854-013-1380-2

Cited by 26 publications

(20 citation statements)

References 20 publications

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“…Extensive researches on the wettability, creep, interfacial reaction and electromigration/thermomigration reliability of Sn58Bi solder has been reported in recent years [16,[18][19][20][21]. To improve the performance of Sn58Bi solder, various researchers have prepared composite solders by adding copper (Cu), nickel (Ni) [22], yttrium oxide (Y 2 O 3 ) [23], lanthanum (La) [24], gallium (Ga) [15] and graphite [25] nanoparticles. Ag nanoparticles have been proven to be good reinforcement materials to enhance the performance of Sn9Zn [26] and Sn0.7Cu [27] solders.…”

Section: Introductionmentioning

confidence: 99%

Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

Chan

2015

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

Chan

2015

Journal of Alloys and Compounds

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“…Fillers [36][37][38][39][40][41] have been added to solders to form solder-matrix composites that exhibit decreased values of coefficient of thermal expansion (CTE) and/or enhanced creep resistance. Graphite particles (100 nm to 500 nm) up to 70 vol.% have been added to tin in order to reduce the CTE; 38 nanosized graphite (400 nm size) has been added to Sn-Bi solder in order to improve the creep resistance, but the addition harms the spreadability of the solder; 39 copper particles have been added to Sn-Zn solder for improving the creep resistance; 40 carbon nanotubes have been added to Sn-Ag-Cu solder for decreasing the CTE, improving the thermal stability, and decreasing the intermetallic compound thickness.…”

Section: Introductionmentioning

confidence: 99%

“…Graphite particles (100 nm to 500 nm) up to 70 vol.% have been added to tin in order to reduce the CTE; 38 nanosized graphite (400 nm size) has been added to Sn-Bi solder in order to improve the creep resistance, but the addition harms the spreadability of the solder; 39 copper particles have been added to Sn-Zn solder for improving the creep resistance; 40 carbon nanotubes have been added to Sn-Ag-Cu solder for decreasing the CTE, improving the thermal stability, and decreasing the intermetallic compound thickness. 36,41 By incorporating 29 vol.% continuous copper-plated carbon fibers in 60Sn-40Pb solder, the CTE is lowered from 24 9 10 À6 /°C to 8 9 10 À6 /°C.…”

Section: Introductionmentioning

confidence: 99%

Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

Sharma

Chung

2015

Journal of Elec Materi

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Low-cost solder-graphite composite sheets ( ‡55 vol.% solder), with solder and graphite forming interpenetrating networks to a degree, are excellent thermal interface materials (TIMs). Solders 63Sn-37Pb and 95.5Sn-4Ag-0.5Cu are separately used, with the latter performing better. In composite fabrication, a mixture of micrometer-size solder powder and ozone-treated exfoliated graphite is compressed to form a graphite network, followed by fluxless solder reflow and subsequent hot pressing to form the solder network. The network connectivity (enhanced by ozone treatment) is lower in the through-thickness direction. The electrical conductivity obeys the rule of mixtures (parallel model in-plane and series model through-thickness), with anisotropy 7. Thermal contact conductance £26 9 10 4 W/(m 2 K) (with 15-lm-roughness copper sandwiching surfaces), through-thickness thermal conductivity £52 W/ (m K), and in-plane thermal expansion coefficient 1 9 10 À5 /°C are obtained. The contact conductance exceeds or is comparable to that of all other TIMs, provided that solder reflow has occurred and the composite thickness is £100 lm. Upon decreasing the thickness below 100 lm, the sandwich thermal resistivity decreases abruptly, the composite through-thickness thermal conductivity increases abruptly to values comparable to the calculated values based on the rule of mixtures (parallel model), and the composite-copper interfacial thermal resistivity (rather than the composite resistivity) becomes dominant.

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“…Li et al 15 studied the influence of reinforcement by Al nanoparticles on the microstructure development and hardness of Sn-58Bi solder; the tensile strength of the alloy increased as the Al content was increased. Yang et al 16 reported that the UTS, elongation, and creep performance were improved by adding nanographite, but the spreadability of the Sn-Bi-nanographite composite solder deteriorated.…”

Section: Introductionmentioning

confidence: 99%

Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder

Yang

Dai

Zhang

et al. 2015

Journal of Elec Materi

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The effect of BaTiO 3 nanoparticles on the microstructure, wettability, and mechanical properties of Sn-58Bi solder has been investigated. The results show that the microstructure of the Sn-58Bi-x wt.%BaTiO 3 (x = 0.5, 1, 2, 3) composite solders is refined and homogeneous due to increasing heterogeneous nucleation sites of BaTiO 3 nanoparticles in the solder matrix. The best wettability with spreading coefficient of 0.86 was obtained for Sn-Bi-1 wt.%BaTiO 3 , increased by 10.24% compared with Sn-58Bi solder. High mechanical properties were achieved for Sn-58Bi solder with small addition (0.5 wt.% to 3 wt.%) of BaTiO 3 . The ultimate tensile strength (UTS) of Sn-58Bi is 44.7 MPa, and that of Sn-Bi-1%BaTiO 3 is 59.1 MPa. Fracture surface analysis indicated that the microscopic fracture of Sn-Bi-1%BaTiO 3 solder is composed of tearing marks and ductility is improved. Therefore, Sn-Bi1%BaTiO 3 composite solder is one of the candidates for packaging and interconnection applications.

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Effect of nanosized graphite on properties of Sn–Bi solder

Cited by 26 publications

References 20 publications

Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder

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