Effect of Nano Copper on the Densification of Spark Plasma Sintered W–Cu Composites

Madhur, Vadde; Srikanth, M.; Annamalai, A. Raja; Muthuchamy, A.; Agrawal, Dinesh Kumar; Jen, Chun-Ping

doi:10.3390/nano11020413

Cited by 21 publications

(3 citation statements)

References 26 publications

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“…Figure 14 shows the effect of HEBM duration on the electrical resistivity and hardness of Cu-Cr alloy sintered at 900 °C for 10 min. Strictly speaking, the conductivity of powder decreases dramatically after HEBM, which can be explained by peening, structural defect accumulation, and grain refinement that introduces electrical resistance into the specimen [139][140][141][142]. Moreover, the specific electrical resistivity of samples was reduced by decreasing the temperature from 197 to -263 °C and showed deviation from linear dependences at -223 °C.…”

Section: Other Propertiesmentioning

confidence: 99%

A critical review on spark plasma sintering of copper and its alloys

et al. 2021

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Copper and its alloys have been in the service of humankind earlier than any other metal throughout history. In the present review, all aspects of the SPS of copper and its alloys are comprehensively investigated, and their potential effects on the microstructure and properties of alloys are thoroughly reviewed. In this regard, the densification phenomenon during SPS treatment is fully investigated. The effects of raw powder characteristics involving particle size, contamination content, and powder morphology on the sinterability of these materials are examined. Then, the influence of SPS operation parameters consisting of pressure, heating rate, dwelling time, pulsed electrical current, electrical pulses pattern, sintering temperature, and sintering tooling on densification of these materials is extensively discussed. Furthermore, the microstructure evolution and grain growth behaviors during SPS are explored. In addition, current challenges and future perspectives of this field are addressed.

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Section: Other Propertiesmentioning

confidence: 99%

A critical review on spark plasma sintering of copper and its alloys

et al. 2021

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“…Therefore, both wear resistance and high-temperature characteristic are essential indicators for high-end applications of W–Cu composites [ 14 ]. However, most studies to date have mainly focused on investigating the hardness and strength of W–Cu composites at room temperature [ 15 , 16 , 17 , 18 , 19 , 20 , 21 ]. For the enhancement of wear resistance and high-temperature strength of W–Cu composites, grain refinement and second-phase strengthening are commonly used methods [ 22 , 23 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Grain Refinement on the Comprehensive Mechanical Performance of W–Cu Composites

et al. 2023

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W–Cu composites are commonly subjected to coupled multiple fields in service, which imposes high requirements on their overall performance. In this study, the ultrafine-grained W–Cu composite was fabricated using the combination of electroless plating and spark plasma sintering. The wear resistance and high-temperature compressive properties of the ultrafine-grained W–Cu composite were investigated and compared with those of the commercial coarse-grained counterpart. Moreover, the underlying strengthening and wear mechanisms were also discussed. Here we show that the ultrafine-grained W–Cu composite exhibits superior integrated mechanical performance, making it a potential alternative to commercial W–Cu composites.

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“…Chemical methods are used for the W–Cu alloy fabrication, but they are often difficult methods, are complex to control, and involve practically non-scalable technologies [ 49 ]. A spark plasma method using a combination of temperature, pressure, and an electric field is used to create a composite densification enhancer [ 50 ].…”

Section: Introductionmentioning

confidence: 99%

Isostatic Hot Pressed W–Cu Composites with Nanosized Grain Boundaries: Microstructure, Structure and Radiation Shielding Efficiency against Gamma Rays

et al. 2022

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The W–Cu composites with nanosized grain boundaries and high effective density were fabricated using a new fast isostatic hot pressing method. A significantly faster method was proposed for the formation of W–Cu composites in comparison to the traditional ones. The influence of both the high temperature and pressure conditions on the microstructure, structure, chemical composition, and density values were observed. It has been shown that W–Cu samples have a polycrystalline well-packed microstructure. The copper performs the function of a matrix that surrounds the tungsten grains. The W–Cu composites have mixed bcc-W (sp. gr. Im3m) and fcc-Cu (sp. gr. Fm3m) phases. The W crystallite sizes vary from 107 to 175 nm depending on the sintering conditions. The optimal sintering regimes of the W–Cu composites with the highest density value of 16.37 g/cm3 were determined. Tungsten–copper composites with thicknesses of 0.06–0.27 cm have been fabricated for the radiation protection efficiency investigation against gamma rays. It has been shown that W–Cu samples have a high shielding efficiency from gamma radiation in the 0.276–1.25 MeV range of energies, which makes them excellent candidates as materials for radiation protection.

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Effect of Nano Copper on the Densification of Spark Plasma Sintered W–Cu Composites

Cited by 21 publications

References 26 publications

A critical review on spark plasma sintering of copper and its alloys

A critical review on spark plasma sintering of copper and its alloys

Effect of Grain Refinement on the Comprehensive Mechanical Performance of W–Cu Composites

Isostatic Hot Pressed W–Cu Composites with Nanosized Grain Boundaries: Microstructure, Structure and Radiation Shielding Efficiency against Gamma Rays

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