Effect of motion accuracy on material removal during the CMP process for large-aperture plane optics

Zhang, C. P.; Zhao, Huiying; Xie, Ruiqing; Zhao, Zixin; Gu, Yawen; Jiang, Zhuangde

doi:10.1007/s00170-017-0857-1

Cited by 5 publications

(2 citation statements)

References 8 publications

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“…Through systematic analysis, they established a uniform polishing method that efficiently enhanced the surface roughness of hard-polished spherical optics. Zhang et al [17] developed a material-removing model to analyze the effects of rotary table run-out error on polishing efficiency and accuracy at any given point on the element. Through an analysis and a series of polishing experiments using the KPJ1700 and KPJ1200 CMP machines, they obtained definitive evidence that reducing the run-out error leads to improved polishing efficiency and accuracy.…”

Section: Introductionmentioning

confidence: 99%

A Polishing Processes Optimization Method for Ring-Pendulum Double-Sided Polisher

et al. 2023

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This paper presents an optimization method that aims to mitigate disturbances in the radial-feed system of the ring-pendulum double-sided polisher (RDP) during processing. We built a radial-feed system model of an RDP and developed a single-tube robust model predictive control system to enhance the disturbance rejection capability of the radial-feed system. To constrain the system states inside the terminal constraint set and further enhance the system’s robustness, we added the ε-approximation to approach the single-tube terminal constraint set. Finally, the effectiveness of the proposed method for the RDP radial-feed system was verified through simulations and experiments. These findings demonstrate the potential of the proposed method for improving the performance of the RDP radial-feed system in practical applications. The polish processing results demonstrated a substantial improvement in the accuracy of the surface shape measurements obtained by applying the STRMPC method. Compared to the MPC method, the PV value decreased from 1.49 λ PV to 0.99 λ PV, indicating an improvement in the convergence rate of approximately 9.78%. Additionally, the RMS value decreased from 0.257 λ RMS to 0.163 λ RMS, demonstrating a remarkable 35.6% enhancement in the convergence rate.

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Section: Introductionmentioning

confidence: 99%

A Polishing Processes Optimization Method for Ring-Pendulum Double-Sided Polisher

et al. 2023

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“…Conventional polishing equipment and methods are difficult to meet in terms of processing accuracy and efficiency. Therefore, it is of great significance to develop a new type of high precision and high efficiency planar ultra-precision ring-throwing machine tool [4].…”

Section: Introductionmentioning

confidence: 99%

Development of an Ultra-Precision Annular Polishing Machine Tool with Full Gas Static Pressure

Tang

Zhang

Lin

2020

KEM

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In order to improve chemical mechanical polishing (CMP) efficiency and accuracy in the fabrication of planar optics, CMP models and machine tools have been developed. A three-dimensional contour map of the surface of the polishing plate was established by measuring the runout error of several circles on the polishing plate. Based on the Preston equation and the three-dimensional contour map, a CMP model that simulates material removal at any point on the work piece is proposed. This model shows that higher motion accuracy can improve efficiency and accuracy. Then, based on this point of view, a new CMP machine tool was designed, and the ultra-precision gas static pressure guide rail and turntable and Siemens 840Dsl numerical control system were applied to the new CMP machine tool. In order to validate the new machine, a series of testing and processing experiments were carried out. The straightness error of the gas static pressure guide rail can be less than 1.1 μm. The axial runout error of the gas turntable can be less than ±0.4 μm. The surface profile of the experimental workpiece can be less than 0.01λ, and the processing efficiency of the new CMP machine can reach 4 times of the processing efficiency of the conventional CMP machine. In addition, the repeatability and stability of the CMP process is improved on new machines.

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Multiparameter optimization design of chemical mechanical polishing for planar optics

Cao

Zhao

Xie

et al. 2021

Int J Adv Manuf Technol

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Effect of motion accuracy on material removal during the CMP process for large-aperture plane optics

Cited by 5 publications

References 8 publications

A Polishing Processes Optimization Method for Ring-Pendulum Double-Sided Polisher

A Polishing Processes Optimization Method for Ring-Pendulum Double-Sided Polisher

Development of an Ultra-Precision Annular Polishing Machine Tool with Full Gas Static Pressure

Multiparameter optimization design of chemical mechanical polishing for planar optics

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