Effect of mild aging on package drop performance for lead free solders

Na, SeokHo; Cha, SeWoong; Kang, WonJoon; Kim, TaeSeong; Hwang, Tae-Yeon; Khim, JinYoung

doi:10.1109/cpmtsympj.2010.5679662

2010 IEEE CPMT Symposium Japan 2010

DOI: 10.1109/cpmtsympj.2010.5679662

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Effect of mild aging on package drop performance for lead free solders

SeokHo Na¹,

SeWoong Cha²,

WonJoon Kang³

et al.

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Effect of mild aging on package drop performance for lead free solders

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