Effect of microstructure and grain size on the thermal conductivity of high-pressure-sintered diamond composites

Екимов, Е. А.; Suetin, N. V.; Попович, А. Ф.; Ralchenko, V.G.; Gromnitskaya, E. L.; Modenov, V. P.

doi:10.1134/s0020168508030035

Cited by 13 publications

(6 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Increasing density of active elements in integrated circuits followed by extensive heat emission localized within small volumes requires finding the solution. This task demands creation of heat-removing materials with a thermal conductivity over 400 W / (mK) [3].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Heat-conducting properties of thermobarically-sintered detonation nanodiamond

Плотников

Bogdanov

et al. 2022

Lett. Mater.

View full text Add to dashboard Cite

The research was conducted to study the thermal conductivity of detonation nanodiamonds-based composites. Composite nanodiamond materials were obtained in the course of thermobaric sintering at the press-free high-pressure apparatus (BARS) under 5 GPa and at temperatures within the range of 1100 -1500°С. It was ascertained that unlike diamond monocrystals with their thermal conductivity reaching up to 2100 W / (mK), the thermal conductivity of a nanodiamond composite is considerably lower and does not go beyond 18 W / (mK). Specifically, the temperature dependence of the thermal conductivity coefficient of a nanodiamond composite is anomalous as compared to a similar dependence in diamond monocrystals. The thermal conductivity coefficient in diamond monocrystals grows in compliance with the rising temperature, whereas it shows practically no changes in a nanodiamond composite in the temperature range of 50 -300°С. Such a temperature dependence of the thermal-conductivity coefficient is apparently related to the features of the phonon spectrum of diamond monocrystals. This feature is stipulated by the dependence of the phonon spectrum of nanocrystals on their size, represented by a set of phonon modes in the range of the wave vector 0 < q <1 / L, i.e., the size of a diamond nanocrystal of 4.5 nm is alleged to limit the excitation of harmonics during nanodiamond composite heating, as opposed to macroscopic crystals that demonstrate the excitation of higher-frequency phonon modes during temperature growing.

show abstract

Section: Introductionmentioning

confidence: 99%

“…One of the possible ways to solve the problem is the development of diamond composite materials at high temperatures and under high pressures using metallic and non-metallic binders [3,6,7]. Normally, sintering of diamond particles at high pressures and temperatures results in an increase in the thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

Heat-conducting properties of thermobarically-sintered detonation nanodiamond

Плотников

Bogdanov

et al. 2022

Lett. Mater.

View full text Add to dashboard Cite

show abstract

“…The LI method is characterized by a very slow fabricating rate and the processing condition such as tightness is highly demanded . Compared with these routes, high temperature–high pressure (HTHP) technique is proved to be more effective in fabricating high thermal conductivity metal/diamond composites . For instance, the thermal conductivity can achieve as high as 900 W m −1 K −1 in Cu/diamond composites produced under a high pressure of 8 GPa .…”

Section: Introductionmentioning

confidence: 99%

“…Compared with these routes, high temperature–high pressure (HTHP) technique is proved to be more effective in fabricating high thermal conductivity metal/diamond composites . For instance, the thermal conductivity can achieve as high as 900 W m −1 K −1 in Cu/diamond composites produced under a high pressure of 8 GPa . The HTHP technique is also favorable for making metal/diamond composites with the formation of diamond skeletons .…”

Section: Introductionmentioning

confidence: 99%

Effect of boron addition on interface microstructure and thermal conductivity of Cu/diamond composites produced by high temperature–high pressure method

Zhang

et al. 2013

Physica Status Solidi (a)

View full text Add to dashboard Cite

In order to obtain high thermal conductivity materials for efficient heat sink applications, diamond particles dispersed Cu-B alloy matrix composites (Cu-B/diamond composites) containing diamond as high as 90 vol.% were produced by a high temperature-high pressure infiltration method. The thermal conductivity of the Cu-0.3 wt.%B/diamond composite was measured to be 731 W m À1 K À1 . The presence of B 4 C on the surface of diamond was identified by Raman scattering. The influence of B addition on interface microstructure was clarified to interpret the thermal conductivity enhancement. The results show that B addition can improve the thermal conductivity of Cu/diamond composites produced by high temperature-high pressure infiltration method.

show abstract

“…12,13 Diamond particle reinforced Al, Cu, Ag composites materials have been extensively studied in recent years. [13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32] In particular, copper/diamond (Cu/Dia) composites show superior thermal properties, such as thermal conductivity roughly three times higher than ordinary composite materials such as Al/SiC or W-Cu, and a price about one-fifth that of all-diamond products. 13,20,[23][24][25][26][27][28][29][30][33][34][35][36][37] The thermal resistance of the package is significantly lower by around 25-33% when using Cu/Dia composites.…”

mentioning

confidence: 99%

Microstructure and thermal conductivity of Cu–B/diamond composites

Chu

Jia

Guo

et al. 2012

Journal of Composite Materials

View full text Add to dashboard Cite

This article considers the potential of boron as matrix-alloying element and gives perspectives about which content of boron is favorable to maximize the interfacial bonding and thermal conductivity of copper/diamond composites. The thermal conductivity of Cu–B/diamond composites is investigated both experimentally and theoretically. The thermal conductivity measurements show that the optimum boron content at 0.8 wt% has provided highest thermal conductivity of 538 W/mK, increases 190% compared to that of copper/diamond composite without boron addition. Theoretical models are used to understand the underlying thermal conductivity enhancement mechanisms of matrix alloying. It is found that the Hasselman–Johnson model combined with a modified Debye model considering the carbide thermal resistance can provide a satisfactory agreement to the experimental data.

show abstract

Effect of microstructure and grain size on the thermal conductivity of high-pressure-sintered diamond composites

Cited by 13 publications

References 7 publications

Heat-conducting properties of thermobarically-sintered detonation nanodiamond

Heat-conducting properties of thermobarically-sintered detonation nanodiamond

Effect of boron addition on interface microstructure and thermal conductivity of Cu/diamond composites produced by high temperature–high pressure method

Microstructure and thermal conductivity of Cu–B/diamond composites

Contact Info

Product

Resources

About