2017
DOI: 10.1155/2017/8230615
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Effect of Microstructural Changes during Annealing on Thermoelectromotive Force and Resistivity of Electrodeposited Ni85.8Fe10.6W1.4Cu2.2 Alloy

Abstract: Cu 2.2 alloy powder containing nanocrystals of an FCC-structured solid solution of iron, tungsten, and copper in nickel embedded in an amorphous matrix was electrodeposited from an ammonia citrate solution. The alloy exhibits thermal stability in the temperature range between 25 ∘ C and 150 ∘ C. Over the range 150−360 ∘ C, the alloy undergoes intense structural relaxation which considerably increases the electron density of states and, hence, its electrical conductivity. Less intense structural relaxation take… Show more

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Cited by 3 publications
(8 citation statements)
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“…Specifically, during the alloy deposition, copper is co-deposited at the limiting diffusion current at high overpotential, which leads to the rapid formation of nuclei and generation of deposits having large surface areas. 50,59,60 The current efficiencies of alloy deposition decrease with increasing current density. At the same current density, the current efficiencies of the copper-containing alloy are higher by about 12% than those of the alloy without copper.…”
Section: Resultsmentioning
confidence: 99%
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“…Specifically, during the alloy deposition, copper is co-deposited at the limiting diffusion current at high overpotential, which leads to the rapid formation of nuclei and generation of deposits having large surface areas. 50,59,60 The current efficiencies of alloy deposition decrease with increasing current density. At the same current density, the current efficiencies of the copper-containing alloy are higher by about 12% than those of the alloy without copper.…”
Section: Resultsmentioning
confidence: 99%
“…The greater density of nuclei on the deposit surface causes the formation of smaller crystalline grains, which exhibit higher internal microstrain values and a higher density of chaotically distributed dislocations. 49,50,59,60 As the mean nanocrystal size decreases, the mass percentage of the amorphous matrix located between the nanocrystals increases. [61][62][63][64] Therefore, Ni/Co electrodeposits with Cu have a larger amount of the amorphous phase compared to those without copper.…”
Section: Resultsmentioning
confidence: 99%
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