Effect of Micron Size Ni Particle Addition on Microstructure, Thermal and Mechanical Properties of Sn-9Zn Lead-Free Solder Alloy

Abstract

This study had been carried out to investigate the effect of micron size Ni particle addition on the microstructure, melting behavior and mechanical properties of the ternary Sn-9Zn solder alloys. Different weight percentage, viz. 0.25, 0.5 and 1 of micron size Ni particle was added in the liquid Sn-9Zn alloy and then cast into the metal mold. Melting behavior was studied by Differential Thermal Analyzer (DTA). Microstructural investigation was conducted using Optical and Scanning Electron Microscope (SEM). Tensile properties were determined at a strain rate 3.00 mm.min-1. The results indicated that Ni addition increased both the melting point and solidification range of the Sn-9Zn solder alloy. The microstructures of newly developed ternary Sn-9Zn-xNi solder alloys consisted of fine needle-like α-Zn phase dispersed in the β-Sn matrix. It was found that small amount of Ni (0.25 wt. %) addition refined and dispersed the Zn needles throughout the matrix. Besides, enhanced precipitation of Zn in the β-Sn matrix was also observed. All these structural changes increased the hardness and tensile strength of Sn-9Zn alloy with the addition of Ni particle to a certain amount.

Effect of the nickel coated precipitated calcium carbonate addition on microstructure, phase and wettability of Sn-9Zn solder

“…4 and this indicates that amount of primary Zn was increased [16]. The existence of Ni coated-PCC reinforcement was found to reduce the diffusion of Sn and Zn during solidification, as explained by Billah et al [16]. This might also contribute to the grain refinement of Zn phase seen.…”

“…4 The Ni coated-PCC additions caused the peak intensity of Sn/Zn ratio reduced as shown in Fig. 4 and this indicates that amount of primary Zn was increased [16]. The existence of Ni coated-PCC reinforcement was found to reduce the diffusion of Sn and Zn during solidification, as explained by Billah et al [16].…”

Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO2 nanoparticles via vacuum melting process

“…Eco-friendly microelectronics are very important and are considered the main target nowadays in the industrial field [1][2][3]. Eutectic Sn-9wt% Zn solder has been informed to be among of the best and most likely alternatives to replace eutectic Sn-37Pb solder in the electronic packaging field as it meets and responds to the electronic industry's needs without increasing soldering temperature [4,5]. The usage of Pb is banned and prohibited due to its harmful effects on human body health, which is the main factor in the progress of the world, and its high toxicity [6,7].…”

“…As a consequence, to get a solution for that, others have concentrated on the manufacture and performance characterization of composite solders reinforced by various nanoparticles to lead-free solder alloys, while some authors have attempted to add trace alloying metals [16]. In view of that, alloying elements such as Bi [9,17], Ag, Cu [18], Ni [4,19,20], and other rare earth elements were selected as alloying additions to the Sn-Zn solder alloy in order to modify the composition. The added trace elements may form strong compounds by reaction with zinc [18], limiting its activity [21], reducing its melting point [10], and forming intermetallic compounds that enhancement the solder's mechanical properties [22].…”

Effect of Strain Rate on Tensile Behavior of Sn-9Zn-xAg-ySb; {(x, y) = (0.2, 0.6), (0.2, 0.8), (0.6, 0.2), (0.8, 0.2)} Lead-Free Solder Alloys

“…As the Sn-9Zn eutectic alloy has many advantages, it is predicted as a suitable replacement for leaded solder alloys. Nowadays a large number of studies on Sn-9Zn-xNi [29], Sn-9Zn-(Cu & Al) [30],…”