Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material

Suzuki, Tomohisa; Terasaki, Takeshi; Kawana, Yuki; Ishikawa, Dai; Nishimura, Masato; Nakako, Hideo; Kurafuchi, Kazuhiko

doi:10.1109/tdmr.2016.2614510

Cited by 22 publications

(8 citation statements)

References 14 publications

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“…However, by virtue of including many pores in s-Ag, it is very difficult to finely estimate the mechanical behaviors. To date, many researchers have tried to examine how porous affect the mechanical properties of s-Ag [ 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 ] by means of indentation test [ 20 ] and bending test [ 21 , 22 , 23 ]. Although the tensile test is one of the most basic mechanical property evaluation tests, these alternative mechanical tests have been utilized for the evaluation due to its technical simplicities.…”

Section: Introductionmentioning

confidence: 99%

Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film

et al. 2020

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This paper investigates the influence of temperature on tensile mechanical properties of sintered silver (s-Ag) films with 8–10 μm in thickness for fundamental reliability design of semiconductor systems. The s-Ag film sintered under a pressure of 60 MPa possesses the porosity (p) around 5% determined from cross-sectional scanning electron microscope (SEM) images. The stress–strain (S-S) curves of s-Ag and pure silver (p-Ag) films are obtained using originally designed uniaxial tensile tester at temperatures from 25 °C to 150 °C. The S-S curves of p-Ag indicate ductile behavior irrespective of temperature, whereas those of s-Ag indicate brittle-ductile transition at 120 °C. Compared with p-Ag, s-Ag possesses low Young’s modulus (E) and high ultimate tensile strength (UTS) below 80 °C. The mechanism of brittle-ductile transition is discussed based on fracture surface observation results.

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Section: Introductionmentioning

confidence: 99%

Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film

et al. 2020

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“…For a detailed understanding of the s-Ag failure mechanism, mechanical tests are helpful, as they work effectively. 11,13,[17][18][19][20][21][22][23] The authors have conducted a uniaxial tensile test to investigate pore dependence on s-Ag mechanical properties at RT, where s-Ag with low pr showed good durability against tensile stress. 21) The trend is similar to the TST results.…”

Section: Introductionmentioning

confidence: 99%

Comparison of sintered silver die attach failure between thermal shock test and mechanical cycling test

Wakamoto

Kumakiri

Otsuka

et al. 2022

Jpn. J. Appl. Phys.

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This paper compares the degradation of sintered silver (s-Ag) die attach between thermal shocked test (TST) and mechanical cycling test to correctly understand the mechanism of s-Ag die attach failure in power module products during practical operation. A bar-shaped specimen is subjected to two types of four-point bending tests: centered bending test (CBT) for bending moment application and shifted bending test (SBT) for shear force application. A crack path in SBT is like that in TST, which suggests that shear force has an important role for imitating the degradation and failure of s-Ag in TST. A crack propagation speed per cycle in TST is, however, about 4,000 times faster than that in SBT. The lifetime assessment period of SBT is approximately 1,400 times shorter than that of TST. The difference in failure mechanism between TST and SBT is discussed by scanning electron microscopy (SEM) of fractured specimens.

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“…One of the difficulties is the s-Ag material characteristic that inevitably includes micropores as a stress concentration area. As for the essential steps for understanding the degradation mechanism during TST, many researchers have investigated micropores' dependence on s-Ag tensile mechanical properties [20][21][22][23][24][25][26][27][28]. Particularly, authors focused on micropores' dependence on its tensile mechanical properties by applying changed process pressure from 5 to 60 MPa with nanosized silver paste (NP) as a function of the s-Ag porosity rate (p) at room temperature [24].…”

Section: Introductionmentioning

confidence: 99%

“…As for the essential steps for understanding the degradation mechanism during TST, many researchers have investigated micropores' dependence on s-Ag tensile mechanical properties [20][21][22][23][24][25][26][27][28]. Particularly, authors focused on micropores' dependence on its tensile mechanical properties by applying changed process pressure from 5 to 60 MPa with nanosized silver paste (NP) as a function of the s-Ag porosity rate (p) at room temperature [24]. Based on the results, s-Ag of a pressure above 30 MPa with around 5% p shows good mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test

et al. 2021

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This paper investigates the degradation mechanism of pressure-sintered silver (s-Ag) film for silicon carbide (SiC) chip assembly with a 2-millimeter-thick copper substrate by means of thermal shock test (TST). Two different types of silver paste, nano-sized silver paste (NP) and nano-micron-sized paste (NMP), were used to sinter the silver film at 300 °C under a pressure of 60 MPa. The mean porosity (p) of the NP and MNP s-Ag films was 2.4% and 8%, respectively. The pore shape of the NP s-Ag was almost spherical, whereas the NMP s-Ag had an irregular shape resembling a peanut shell. After performing the TST at temperatures ranging from −40 to 150 °C, the scanning acoustic tomography (SAT) results suggested that delamination occurs from the edge of the assembly, and the delamination of the NMP s-Ag assembly was faster than that of the NM s-Ag assembly. The NMP s-Ag assembly showed a random delamination, indicating that the delamination speed varies from place to place. The difference in fracture mechanism is discussed based on cross-sectional scanning electron microscope (SEM) observation results after TST and plastic strain distribution results estimated by finite element analysis (FEA) considering pore configuration.

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Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material

Cited by 22 publications

References 14 publications

Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film

Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film

Comparison of sintered silver die attach failure between thermal shock test and mechanical cycling test

Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test

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