2008
DOI: 10.4139/sfj.59.408
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Effect of Magnetic Field on Copper Electroplating-Application to Through-Hole Plating

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“…This kind of convection has been reported by Aogaki et al in copper electrodeposition. (19,20) Bund et al also reported this magnetic convection because of the gradient of magnetic susceptibility in the solution, especially between the bulk and Nernst layer in copper electrodeposition. (17) In this experiment, during the porous growth, the micro MHD affects the ionic migration, O 2− , OH − , Al 3+ , during oxide dissolution for pore growth in a circular manner along the pore channel.…”
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confidence: 99%
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“…This kind of convection has been reported by Aogaki et al in copper electrodeposition. (19,20) Bund et al also reported this magnetic convection because of the gradient of magnetic susceptibility in the solution, especially between the bulk and Nernst layer in copper electrodeposition. (17) In this experiment, during the porous growth, the micro MHD affects the ionic migration, O 2− , OH − , Al 3+ , during oxide dissolution for pore growth in a circular manner along the pore channel.…”
mentioning
confidence: 99%
“…(18) The additional effect, called micro-MHD, was also observed in the electrodeposition of copper, which resulted in numerous microscopic vortices in the vicinity of the precipitation interface on the surface of the cathode and suppressed crystal growth of electrodeposited Cu on the cathode. (19,20) Meanwhile, there remain few reports of the application of a magnetic field to anodic oxidation. (21) In this study, the effect of magnetic field imposition on the surface morphology of anodized oxide film was investigated for various magnetic fields.…”
Section: Introductionmentioning
confidence: 99%