Metallization (known as contacting)
of thermoelectric (TE) legs
is vital to the long-term performance of a TE device. It is often
observed that the compositional changes in a TE solid solution may
render a given contact material unsuitable due to a mismatch in the
thermal expansion coefficient values. Finding suitable contact materials
for TE solid solutions (which often are the best TE materials) remains
a challenge. In this work, we propose a multilayer single-step approach
in which the same combination of contact materials can be used for
a wide compositional range in a solid solution. The outer layer is
a metal foil, which helps in creating an Ohmic contact with the interconnects.
The intermediate layer is a mixture of the TE material and a metal
powder, which results in the formation of the diffusion barrier. The
innermost layer is the TE material, which is the active component
of the device. The strategy was applied on n- and p-doped Mg2Si0.3Sn0.7 with elemental Cu and Ni providing
the desired interface functionalities. Single-step compaction was
carried out using the monoblock sintering technique. Microscopic investigation
reveals the formation of a well-bonded crack-free interface. Various
intermetallic phases were identified at the interface, and the formation
of the MgNi2Sn phase was found to be critical to prevent
any interdiffusion of elements. Electrical contact resistance (r
c) measurements were conducted, and low values
of 3 and 19 μΩ cm2 were measured in n- and
p-type legs, respectively. The contacted TE legs were further annealed
at 400 °C for 7 days to check their stability. Microstructural
and electrical resistance measurements reveal minimal changes in the
interface layer and r
c values, indicating
the workability of the multilayer technique.