Effect of iron(III) and lead(II) on the quality of copper electrodeposited from a pyrophosphate bath

The effect of lead and iron ions on copper electrodeposited from a pyrophosphate bath

“…4 In the present study, we report that palladium may also be concentrated from solution by sulphides, and in a high-resolution XPS study, have re-examined the Au(II1) reduction, focusing on the chemical changes in the sulphide surface which occurs during the reduction of both gold and palladium. affected the reduction process.…”

“…(2) the bath can tolerate high current densities; (3) it has a good throwing power; (4) it is non-corrosive and non-toxic; and (5) above all, the physical properties are good and the structure of the deposits are thin, homogeneous and finegrained.' However, these baths are very sensitive to polluting ion species.…”

Electrodeposition of Copper

“…Pyrophosphate deposits are also used on steel [491,497,498] and aluminum parts [499][500][501][502][503][504], and in some cases, they serve as a replacement for cyanide deposits [505,506]. Other applications include plating zinc die castings [507,508] before bright nickel and chromium plating, as a lubricant for wire deep drawing operations [485,491], as a stopoff on steel for selective hardening operations such as nitriding and carburizing [485,[509][510][511][512], in roll plating [485], in minimizing hydrogen embrittlement [513,514], and in the manufacture of plated steel cord for radial tires and high-pressure plastic pipes [515,516]. Pyrophosphate solutions are also used for plating through holes on printed wiring boards, although in most cases this application has been replaced by high-throw acid copper sulfate formulations [490,[517][518][519].…”

“…Phosphorus included in the deposit was reported to influence external appearance, microhardness, and microstructure [584]. Iron and lead can alter deposit morphology and concentrations below 200 and 1000 ppm, respectively, are recommended [516]. Chloride ion, which is known to affect anode reactions, can be tolerated at concentrations lower than 0.1 M with vigorous agitation of the solution [515].…”