Effect of insulating material and structure on the reliability of silicon through hole under thermal stress

Li, Zongyang; Yao, Quanbin; Lin, Pengrong; Huang, Yingzhuo; Xie, Xiaochen; Qu, Zhibo; Xie, Shuang; Meng, Jinxiao

doi:10.1109/icept59018.2023.10492383

2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023

DOI: 10.1109/icept59018.2023.10492383

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Effect of insulating material and structure on the reliability of silicon through hole under thermal stress

Zongyang Li,

Quanbin Yao,

Pengrong Lin

et al.

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Effect of insulating material and structure on the reliability of silicon through hole under thermal stress

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References 12 publications

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