2011
DOI: 10.1063/1.3572339
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Effect of impurities on thermal stability of pseudomorphically strained Si:C layer

Abstract: We investigate the thermal stability of pseudomorphically strained Si:C layer using high resolution x-ray diffraction (HRXRD) and Fourier transform infrared (FTIR) spectroscopy. Far below β-SiC precipitation threshold, almost complete strain relaxation is found without significant substitutional carbon (Csub) loss. FTIR shows the strain relaxation is related to volume compensation by Csub-interstitial complex formation through oxidation injection of interstitial. By multilayer HRXRD kinematical simulation, we … Show more

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Cited by 10 publications
(11 citation statements)
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“…Similarly, in the presence of impurities such as deactivated phosphorous or injected oxygen, the easier pathway for strain relaxation in strained Si:C is local volume compensation through formation of C sub -interstitial complexes by gettering of interstitial atoms around C sub atoms. 16 From literature, it is known that by simply treating the silicon surface with HF prior to dopant activation annealing, significant retardation of TED was found due to passivation of surface dangling bonds by hydrogen. 28 In our case, with HF pretreatment prior to post-annealing, the lack of surface oxide as a seed for oxygen diffusion and oxidation enhanced interstitial injection into bulk may explain the strain relaxation reduction observed.…”
Section: Discussionmentioning
confidence: 99%
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“…Similarly, in the presence of impurities such as deactivated phosphorous or injected oxygen, the easier pathway for strain relaxation in strained Si:C is local volume compensation through formation of C sub -interstitial complexes by gettering of interstitial atoms around C sub atoms. 16 From literature, it is known that by simply treating the silicon surface with HF prior to dopant activation annealing, significant retardation of TED was found due to passivation of surface dangling bonds by hydrogen. 28 In our case, with HF pretreatment prior to post-annealing, the lack of surface oxide as a seed for oxygen diffusion and oxidation enhanced interstitial injection into bulk may explain the strain relaxation reduction observed.…”
Section: Discussionmentioning
confidence: 99%
“…Recent researches revealed that undesirable strain relaxation in Si:C S/D occurs upon being provided additional thermal energy during post-processes after junction formation. 15,16 It is therefore important to understand the detailed mechanisms involved in strain relaxation processes and find out the limit of strain-doping coexistence in Si:C S/D in order to realize integration of this technology into microelectronic devices in near future.…”
Section: Introductionmentioning
confidence: 99%
“…10. The weak stress from Si:C layers using Cascade-1 is considered to be caused by quite surplus interstitial C at the surface region [6]. Furthermore, low R s in Si:C layers with and without NiPtSi formed by Cascade-2 can be achieved, as shown in Fig.…”
Section: Impact Of Cascade C 7 H X Implantation On Channel Stress Andmentioning
confidence: 95%
“…Strain was measured by high-resolution X-ray diffractometry (HRXRD) using Cu K¡ 1 X-ray diffraction around the (004) Si peak. 19) Since the solid solubility of C in Si is only of the order of 10 17 atoms/cm 3 , the naive assumption of full incorporation of implanted C ions into the Si lattice by SPER may not be correct, contrary to the fully miscible case of Ge. 17) Furthermore, there may be complicated interplays between the implanted dopant impurities and C. For example, enhanced dopant activation upon C + co-implant was reported.…”
mentioning
confidence: 99%