2018
DOI: 10.1016/j.matlet.2018.07.080
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Effect of high entropy alloys TiVCrZrHf barrier layer on microstructure and texture of Cu thin films

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Cited by 16 publications
(2 citation statements)
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“…All the cross-section morphologies are typical dense columnar structures, as shown in Figure 7 a–d. The grain sizes of the different components obtained in Table 6 according to the Scherrer equation: where k is the shape factor ( k = 0.943 [ 43 ]), is the full width at half-maximum. The grain size of the ZrMoTaW film is between 10 nm and 15 nm.…”
Section: Resultsmentioning
confidence: 99%
“…All the cross-section morphologies are typical dense columnar structures, as shown in Figure 7 a–d. The grain sizes of the different components obtained in Table 6 according to the Scherrer equation: where k is the shape factor ( k = 0.943 [ 43 ]), is the full width at half-maximum. The grain size of the ZrMoTaW film is between 10 nm and 15 nm.…”
Section: Resultsmentioning
confidence: 99%
“…A barrier material is needed to improve the reliability and the stability of such material. Peng et al [103] studied a TiVCrZrHf HEF deposited by magnetron sputtering on Si/SiO 2 as a barrier layer for copper. The results revealed that HEF retarded the diffusion of copper at temperatures below 600 • C. A failure was observed at 700 • C, since TiVCrZrHf crystallized and an interdiffusion between the coating and copper occurred.…”
Section: Diffusion Barrier Applicationmentioning
confidence: 99%