Effect of heat treatment on bonding mechanism and mechanical properties of high strength Cu/Al/Cu clad composite

Wang, Yongjin; Song, Ren‐Jie; Ye, Jun; Li, Huan

doi:10.1016/j.jallcom.2019.06.132

Cited by 35 publications

(5 citation statements)

References 30 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Four major techniques are commonly used that can be further subdivided. The first class incorporates cladding methods like roll cladding, [29][30][31][32][33][34] thermo-compression bonding, 12,26,35 and friction welding. [36][37][38] The second class includes vapor deposition techniques like physical (PVD) and chemical vapor deposition (CVD).…”

mentioning

confidence: 99%

How to Obtain High Load-Bearing Al-Cu Joints by Nanoscale Sculpturing

Gerngross,

Baytekin-Gerngross,

Carstensen

et al. 2024

J. Electrochem. Soc.

View full text Add to dashboard Cite

The electrochemical formation of high-mechanical-load-bearing Al-Cu joints and their characterization is presented. These Al-Cu joints rely on a mechanical interlocking between the Al and Cu layer ob-tained by nanoscale sculpturing of the Al joint partner, resulting in a hierarchical surface structure. The structure consists of cubes of var-ious sizes acting like hooks. When enclosed by Cu the cubic Al hooks establish a rigid connection between the Al and Cu joint part-ners. In addition, the hierarchical cubic Al structures allow for a gradual transition from Al to Cu in the Al-Cu joint. Therefore, such Al-Cu joints exhibit an extraordinary load carrying ability compared to other Al-Cu joints.

show abstract

mentioning

confidence: 99%

How to Obtain High Load-Bearing Al-Cu Joints by Nanoscale Sculpturing

Gerngross,

Baytekin-Gerngross,

Carstensen

et al. 2024

J. Electrochem. Soc.

View full text Add to dashboard Cite

show abstract

“…Cu/Al/Cu clad plates were annealed at temperatures from 200 to 500 • C for 3 h after cold roll-bonding. The Al/Cu bonding strength at room temperature was measured by peel tests [12,20] using a Universal Mechanical Testing System (US/SSTM, Fullerton, CA, USA). Peel tests were carried out at a crosshead speed of 1 mm/min and 3 different experiments were conducted for each condition.…”

Section: Methodsmentioning

confidence: 99%

“…However, the applications of Al in electrical cables and bus bars, which require better conductivity and strength, are still limited. Given the individual advantages and limitations of the Cu and Al, demand for Cu/Al clad composites [14,20,21], which exhibit excellent electrical properties and specific strength, is steadily increasing. Once the stability and reliability of the clad composites and interfaces between these two metals have been secured, they may replace Cu because of advantages associated with weight and price competitiveness.…”

Section: Introductionmentioning

confidence: 99%

Effect of Intermetallic Compound Layer on Peel Strength and Crack Propagation Behavior in Cu/Al/Cu Clad Composites

Kim

Hong

2019

Metals

View full text Add to dashboard Cite

The effects of interfacial modification in tri-layered Cu/Al/Cu composites by heat treatment on interface stability and crack propagation were investigated. In order to investigate the crack path during the peel test, the intermetallic compound layer with the propagating crack was examined using electron backscatter diffraction (EBSD) analyses. The increase of peel strength from 7.8 to 9.1 N/mm in the tri-layered Cu/Al/Cu composite in the presence of thin discontinuous intermetallic compounds with heat treatment at 200–300 °C was accompanied by the increase of electrical conductivity from 65.3% IACS (International Annealed Copper Standard) to 66.8% IACS. Continuous intermetallic layers consisting of Al2Cu, AlCu, and Al4Cu9 were found in Cu/Al/Cu heat-treated at temperatures above 350 °C and its thickness increased rapidly and reached up to 35.2 μm at 500 °C. The peel strength drastically decreased to 5.75 N/mm after heat treatment at 400 °C, and it gradually increased as the heat treatment temperature was increased to 450 °C (5.91 N/mm) and 500 °C (6.16 N/mm). The increased peel strengths after heat treatment at 450 and 500 °C were accompanied by pronounced serrations of the peel strength–displacement curves. The amplitude of serration increased substantially with increasing annealing temperature from 400 to 500 °C. The major crack along the interface propagated, mostly along the Al2Cu/AlCu boundary with some inclined cracks, propagated through the AlCu and Al4Cu9 intermetallic compound layers. The repetition of crack propagation along the interface and crack deflection through the intermetallic layer as an inclined crack induced the serrated surface on the peeled-off Cu plate, enhancing the interface toughening.

show abstract

“…Bimetallic composites composed of two different components have been widely used because of their excellent corrosion resistance, fatigue resistance, and low thermal conductivity. [1,2] Among them Cu/Al composites have been widely used in many fields due to their excellent electrical property and good corrosion resistance. [3,4] However, intermetallic compounds(IMCs), like Al 2 Cu, AlCu, and Al 2 Cu 3 are easily formed between them due to the strong chemical affinity between Al and Cu.…”

Section: Introductionmentioning

confidence: 99%

First‐Principles Study on X (Co, In, Ni, Pd, Ge, Ca) Doping on the Structural Stability and Mechanical Properties of AlCu.

Yang,

Liu,

Gan

et al. 2023

Cryst. Res. Technol.

View full text Add to dashboard Cite

The stability, mechanical property, electronic structure, and Debye temperature of Al‐Cu‐X ternary compounds formed by X (Co, In, Ni, Pd, Ge, Ca) doped AlCu are systematically studied by first‐principles calculations based on density functional theory (DFT). The cohesive energy and formation enthalpy results of Al‐Cu‐X show that the structure is thermodynamically stable, which are consistent with the data previously reported. Elastic modulus results that are estimated by Voigt‐Reuss‐Hill approximation. It shows that Co, Ni, and Pd increase the bulk modulus of AlCu, while In, Ge, and Ca decrease the bulk modulus of AlCu. Co, In, Ni, Pd, Ge, and Ca decrease the shear modulus and Young's modulus of AlCu. In addition, the anisotropy of Al‐Cu‐X is studied by different anisotropy indexes and Young's modulus spatial distribution figure. The electronic structures of Al‐Cu‐X ternary compounds are calculated and analyzed. It shows that the Co, In, Ni, and Pd elements are mainly hybridized with the Cu‐d orbital, while Ge and Ca are hybridized with the Al‐p orbital. Moreover, the sound velocity and Debye temperature of Al‐Cu‐X are discussed.

show abstract

Effect of heat treatment on bonding mechanism and mechanical properties of high strength Cu/Al/Cu clad composite

Cited by 35 publications

References 30 publications

How to Obtain High Load-Bearing Al-Cu Joints by Nanoscale Sculpturing

How to Obtain High Load-Bearing Al-Cu Joints by Nanoscale Sculpturing

Effect of Intermetallic Compound Layer on Peel Strength and Crack Propagation Behavior in Cu/Al/Cu Clad Composites

First‐Principles Study on X (Co, In, Ni, Pd, Ge, Ca) Doping on the Structural Stability and Mechanical Properties of AlCu.

Contact Info

Product

Resources

About