Effect of grain size on nano-indentation property of Co60Fe20B20 thin film

Chen, Yuan-Tsung; Wu, Chia-Wen

doi:10.1016/j.jallcom.2012.10.048

Cited by 4 publications

(1 citation statement)

References 15 publications

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“…This indicates that the smaller grains can enhance higher and values than larger grains, which also explains a strong nanomechanical performance at asdeposited and thinner films. The result of Ta thin films is consistent with the CoFeB and NiFe thin films [18][19][20]. The and of Ta films declined as the thickness increased, and the postannealing temperature was enhanced.…”

Section: Resultssupporting

confidence: 81%

Nanoindentation and Adhesion Properties of Ta Thin Films

Chen

2013

Journal of Nanomaterials

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Ta films were sputtered onto a glass substrate with thicknesses from 500 Å to 1500 Å under the following conditions: (a) as-deposited films were maintained at room temperature (RT), (b) films were postannealed atTA=150°C for 1 h, and (c) films were postannealed atTA=250°C for 1 h. X-ray diffraction (XRD) results revealed that the Ta films had a body-centered cubic (BCC) structure. Postannealing conditions and thicker Ta films exhibited a stronger Ta (110) crystallization than as-deposited and thinner films. The nanoindention results revealed that Ta thin films are sensitive to mean grain size, including a valuable hardness (H) and Young’s modulus (E). High nanomechanical properties of as-deposited and thinner films can be investigated by grain refinement, which is consistent with the Hall-Petch effect. The surface energy of as-deposited Ta films was higher than that in postannealing treatments. The adhesion of as-deposited Ta films was stronger than postannealing treatments because of crystalline degree effect. The maximalHandEand the optimal adhesion of an as-deposited 500-Å-thick Ta film were 15.6 GPa, 180 GPa, and 51.56 mJ/mm2, respectively, suggesting that a 500-Å-thick Ta thin film can be used in seed and protective layer applications.

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Section: Resultssupporting

confidence: 81%