Effect of Geometry Upon Cooling Characteristics of Wafer Block Coolers

Abstract

The product formed after the cream is spread between the wafer sheets is called a wafer block. The wafer block can have a minimum of 3 layers (2 sheets, 1 cream) and a maximum of 9 layers (5 sheets, 4 creams). The temperature of the wafer block before entering the cooling tower is 30-35°C. After the cooling process is completed, it cannot be reduced to the outlet temperature (~16°C) and the temperature is not homogeneously distributed. Especially the middle regions are hot. In this paper, the homogeneous temperature distribution is aimed at by using the CFD method. CFD analysis of three predetermined designs was performed using Solidworks / Flow Simulation software. The first design is the one currently used. In the second design, a design improvement has been made to reduce the effect of vortices in dead zones. In the third design, a design improvement was made to positively affect the flow rate in the upper region where the evaporator and fan are located. In the second design, the temperature difference on the wafer block is reduced by 0.02°C compared to the current design. The third design decreases by 0.13°C compared to the second design.

Roll-Bond Heat Exchanger (Rhe) Design and Application to a Chocolate Cooling Tunnel - A Numerical Study

“…For this reason, all parts of the products cannot be cooled homogeneously, and the liquid chocolate in the lower parts of the products adheres to the PVC tape, and the integrity of the coating on the product is disrupted [12]. Many studies have been conducted in the literature on product integrity, product quality, and the effect of production machinery on food and similar problems [13][14][15][16][17][18]. In order to prevent non-cooling problems experienced in the lower parts of chocolate-coated products, the surface in contact with the product's underside must also be cooled.…”